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LH79524/LH79525 (A.1)
Preliminary data sheet
FEATURES
* Highly Integrated System-on-Chip * High Performance: 76.205 MHz CPU Speed, 50.803 MHz maximum AHB clock (HCLK) * 32-bit ARM720TTM RISC Core - LH79524: 32-bit External Data Bus - 208 LFBGA package - LH79525: 16-bit External Data Bus - 176 LQFP package * 8 kB Cache with Write Back Buffer * MMU (Windows CETM Enabled) * 16 kB On-Chip SRAM * Flexible, Programmable Memory Interface - SDRAM Interface - 512 MB External Address Space - 32-bit External Data Bus (LH79524) - 16-bit External Data Bus (LH79525) - SRAM/Flash/ROM Interface - 15-bit External Address Bus - 32-bit External Data Bus (LH79524) - 16-bit External Data Bus (LH79525) * Multi-stream DMA Controller - Four 32-bit Burst-Based Data Streams * Clock and Power Management - 32.768 kHz Oscillator for Real Time Clock - 10 MHz to 20 MHz Oscillator and On-chip PLL - Active, Standby, Sleep, Stop1, and Stop2 Modes - Externally-supplied Clock Options * On-Chip Boot ROM - Allows Booting from 8-, 16-, or 32-bit Devices - NAND Flash Boot * Low Power Modes - Active Mode: 85 mA (MAX.) - Standby Mode: 50 mA (MAX.) - Sleep Mode: 3.8 mA (TYP.) - Stop Mode 1: 420 A (TYP.) - Stop Mode 2: 25 A (TYP.) * USB Device - Compliant with USB 2.0 Specifications (Full Speed) - Four Endpoints * Ethernet MAC, with MII and MDIO Interfaces - IEEE 802.3 Compliant - 10 and 100 Mbit/s Operation * Analog-to-Digital Converter/Brownout Detector - 10-bit ADC - Pen Sense Interrupt - Integrated Touch Screen Controller (TSC) Preliminary data sheet 1 * I2C Module * Integrated Codec Interface Support Features (I2S) * Watchdog Timer * Vectored Interrupt Controller - 16 Standard and 16 Vectored IRQ Interrupts - Interrupts Individually Configurable as IRQ or FIQ * Three UARTs - 16-entry FIFOs for Rx and Tx - IrDA SIR Support on all UARTs * Three 16-bit Timers with PWM capability * Real Time Clock - 32-bit Up-counter with Programmable Load - Programmable 32-bit Match Compare Register * Programmable General Purpose I/O Signals - LH79524: 108 available pins on 14 ports - LH79525: 86 available pins on 12 ports * Programmable Color LCD Controller - 16 (LH79524) or 12 (LH79525) Bits-per-Pixel - Up to 800 x 600 resolution - STN, Color STN, HR-TFT, AD-TFT, TFT - TFT: Supports 64 k (LH79524) or 4 k (LH79525) Direct Colors or 256 colors selected from a Palette of 64 k Colors; 15 Shades of Gray - Color STN: Supports 3,375 Direct Colors or 256 Colors Selected from a Palette of 3,375 Colors * Synchronous Serial Port - Supports Data Rates Up to 1.8452 Mbit/s - Compatible with Common Interface Schemes * JTAG Debug Interface and Boundary Scan * 5 V Tolerant Digital Inputs (excludes oscillator pins) - XTALIN and XTAL32IN pins are 1.8 V 10% * On-Chip regulator allows single 3.3 V supply
System-on-Chip
DESCRIPTION
The LH79524/LH79525, powered by an ARM720T, is a complete System-on-Chip with a high level of integration to satisfy a wide range of requirements and applications. The SoC has a fully static design, power management unit, and low voltage operation (1.8 V Core, 3.3 V I/O). With the on-chip voltage regulator, a single 3.3 V supply can be used as well. Robust peripherals and a low-power RISC core provide high performance at a reasonable price.
LH79524/LH79525
NXP Semiconductors
System-on-Chip
ORDERING INFORMATION
Table 1. Ordering information Package Type number Name LH79524N0F100A0 LH79524N0F100A1 LH79525N0Q100A0 LH79525N0Q100A1 LFBGA208 LFBGA208 LQFP176 LQFP176 Description plastic low profile fine-pitch ball grid array package; 208 balls plastic low profile fine-pitch ball grid array package; 208 balls plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm SOT1019-1 SOT1019-1 SOT1017-1 SOT1017-1 Version
2
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
10 - 20 MHz
32.768 kHz
LH79524/LH79525
OSCILLATOR, PLL(2), POWER MANAGEMENT, and RESET CONTROL
REAL TIME CLOCK
ARM720T
CONDITIONED EXTERNAL INTERRUPTS
GENERAL PURPOSE I/O
CACHE VECTORED INTERRUPT CONTROLLER
I/O CONFIGURATION
INTERNAL INTERRUPTS
SYNCHRONOUS SERIAL PORT
INTERNAL 16KB SRAM
ETHERNET MAC
SSP - I2S CONVERTER (WITH CODEC INTERFACE)
BOOT ROM
BOOT CONTROLLER COUNTER/ TIMER (3) 4 CHANNEL DMA CONTROLLER
EXTERNAL MEMORY CONTROLLER
WATCHDOG TIMER
USB DEVICE
ADVANCED PERIPHERAL BUS BRIDGE
I2C
TEST SUPPORT
COLOR LCD CONTROLLER
16550 UART (3) w/SIR
LINEAR REGULATOR
ADVANCED LCD INTERFACE ADVANCED PERPHERAL BUS (APB)
10 CHANNEL 10-BIT ADC (WITH TSC and BROWNOUT DETECTOR)
ADVANCED HIGH PERFORMANCE BUS (AHB)
LH79525-1
Figure 1. LH79524/LH79525 block diagram
Preliminary data sheet
Rev. 01 -- 16 July 2007
3
LH79524/LH79525
NXP Semiconductors
System-on-Chip
ball A1 index area 1 A B C D E F G H J K L M N P R T
LH79524
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
002aad214
Transparent top view
Figure 2. LH79524 pin configuration (LFBGA208)
176
1
133 132
LH79525
44 45 88
89
002aad213
Figure 3. LH79525 pin configuration (LQFP176)
4
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
SIGNAL DESCRIPTIONS
Table 2. LH79524 Pin Descriptions
LFBGA PIN T12 R11 T11 P10 R10 T10 P9 R9 T9 T8 R8 P8 T7 R7 P7 T6 M15 N16 L13 M14 N15 P16 M13 N14 F14 G15 D13 E13 E14 G14 G16 H14 H15 H16 L16 L15 M16 L14 J15 J14 K16 K15 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 D0 D1 D2 D3 D4 D5 D6 D7 SDCLK SDCKE DQM0 DQM1 DQM2 DQM3 nDCS0 nDCS1 nRAS nCAS nCS0/PM0 nCS1/PM1 nCS2/PM2 nCS3/PM3 nBLE0/PM4 nBLE1/PM5 nBLE2/PM6 nBLE3/PM7 O Static Memory Byte Lane Enable / Byte Write Enable; multiplexed with GPIO Port M[7:4] (output only) O Static Memory Chip Select; multiplexed with GPIO Port M[3:0] (output only) O O O O SDRAM Chip Select SDRAM Chip Select Row Address Strobe Column Address Strobe O Data Mask Output to SDRAMs O O SDRAM Clock SDRAM Clock Enable I/O External Data Bus O External Address Bus SIGNAL NAME TYPE DESCRIPTION
Preliminary data sheet
Rev. 01 -- 16 July 2007
5
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 2. LH79524 Pin Descriptions (Cont'd)
LFBGA PIN K14 J16 A16 A15 E2 F2 G2 H2 H3 F1 F3 E1 G3 G1 J3 N1 M2 L3 M1 L2 L1 K3 K2 R2 R1 P2 N3 M4 P1 N2 SIGNAL NAME nOE nWE USBDN USBDP AN0/UL/X+ AN1/UR/X- AN2/LL/Y+/PJ3 AN3/LR/Y-/PJ0 AN4/WIPER/PJ1 AN5/PJ5/INT5 AN6/PJ7/INT7 AN7/PJ6/INT6 AN8/PJ4 AN9/PJ2 CTCLK/INT4/BATCNTL PA0/INT2/UARTRX2/ UARTIRRX2 PA1/INT3/UARTTX2/ UARTIRTX2 PA2/CTCAP0A/ CTCMP0A PA3/CTCAP0B/ CTCMP0B PA4/CTCAP1A/ CTCMP1A PA5/CTCAP1B/ CTCMP1B PA6/CTCAP2A/ CTCMP2A/SDA PA7/CTCAP2B/ CTCMP2B/SCL PB0/nDACK/ nUARTCTS0 PB1/DREQ/ nUARTRTS0 PB2/SSPFRM/I2SWS PB3/SSPCLK/I2SCLK PB4/SSPRX/I2SRXD/ UARTRX1/ UARTIRRX1 PB5/SSPTX/I2STXD/ UARTTX1/UARTIRTX1 PB6/INT0/UARTRX0/ UARTIRRX0 TYPE O O I/O I/O I I I I I I I I I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Static Memory Output Enable Static Memory Write Enable USB Data Negative (Differential Pair output, single ended and Differential pair input) USB Data Positive (Differential Pair output, single ended and Differential pair input) ADC Input 0, 4-wire touch screen Upper Left, 5-wire touch screen X+ ADC Input 1, 4-wire touch screen Upper Right, 5-wire touch screen X- ADC Input 2, 4-wire touch screen Lower Left, 5-wire touch screen Y+; multiplexed with GPIO Port J3 (input only) ADC Input 3, 4-wire touch screen Upper Right, 5-wire touch screen Y-; multiplexed with GPIO Port J0 (input only) ADC Input 4, 5-wire touch screen Wiper input; multiplexed with GPIO Port J1 (input only) ADC Input 5; multiplexed with GPIO Port J5 (input only) and External Interrupt 5 ADC Input 6; multiplexed with GPIO Port J7 (input only) and External Interrupt 7 ADC Input 7; multiplexed with GPIO Port J6 (input only) and External Interrupt 6 ADC Input 8; multiplexed with GPIO Port J4 (input only) ADC Input 9; multiplexed with GPIO Port J2 (input only) Timer[2:0] External Clock input; muxed with External Int 4 and Battery Control General Purpose I/O Signal -- Port A0; multiplexed with UART2 Received Serial Data Input, UART2 Infrared Received Serial Data In, and External Interrupt 2 General Purpose I/O Signal -- Port A1; multiplexed with UART2 Transmitted Serial Data Output, UART2 Serial Transmit Data Out, and External Interrupt 3 General Purpose I/O Signal -- Port A2; multiplexed with Counter/Timer 0 Capture A input and Counter/Timer 0 Compare A output General Purpose I/O Signal -- Port A3; multiplexed with Counter/Timer 0 Capture B input and Counter/Timer 0 Compare B output General Purpose I/O Signal -- Port A4; multiplexed with Counter/Timer 1 Capture A input and Counter/Timer 1 Compare A output General Purpose I/O Signal -- Port A5; multiplexed with Counter/Timer 1 Capture B input and Counter/Timer 1 Compare B output General Purpose I/O Signal -- Port A6; multiplexed with Counter/Timer 2 Capture A input, Counter/Timer 2 Compare A output, I2C Bus Data (open drain) General Purpose I/O Signal -- Port A7; multiplexed with Counter/Timer 2 Capture B input, Counter/Timer 2 Compare B output, I2C Bus Clock (open drain) General Purpose I/O Signal -- Port B0; multiplexed with DMA Acknowledge and UART0 CTS General Purpose I/O Signal -- Port B1; multiplexed with DMA Request and UART0 RTS General Purpose I/O Signal -- Port B2; multiplexed with SSP Serial Frame Output and I2S Frame Output General Purpose I/O Signal -- Port B3; multiplexed with SSP Clock and I2S Clock General Purpose I/O Signal -- Port B4; multiplexed with SSP Data In, I2S Data In, UART1 Serial Data In, and UART1 Infrared Data In General Purpose I/O Signal -- Port B5; multiplexed with SSP Data Out, I2S Data Out, UART1 Data Out, and UART1 IR Data Out General Purpose I/O Signal -- Port B6; multiplexed with UART0 Infrared Received Serial Data Input, UART0 Received Serial Data In, and External Interrupt 0 DESCRIPTION
6
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 2. LH79524 Pin Descriptions (Cont'd)
LFBGA PIN M3 N7 R6 T5 P6 R5 T4 P5 R4 P15 P14 N13 T15 N12 T14 P12 T13 B12 D11 B13 C13 D12 B16 B15 D14 A8 A9 B9 C9 B10 A11 B11 A12 A5 B6 A6 C7 B7 SIGNAL NAME PB7/INT1/UARTTX0/ UARTIRTX0 PC0/A16 PC1/A17 PC2/A18 PC3/A19 PC4/A20 PC5/A21 PC6/A22/nFWE PC7/A23/nFRE PD0/D8 PD1/D9 PD2/D10 PD3/D11 PD4/D12 PD5/D13 PD6/D14 PD7/D15 PE0/LCDLP/ LCDHRLP PE1/LCDDCLK PE2/LCDPS PE3/LCDCLS PE4/LCDDSPLEN/ LCDREV PE5/LCDVDDEN PE6/LCDVEEN/ LCDMOD PE7/nWAIT/nDEOT PF0/LCDVD6 PF1/LCDVD7 PF2/LCDVD8 PF3/LCDVD9 PF4/LCDVD10 PF5/LCDVD11 PF6/LCDEN/LCDSPL PF7/LCDFP/LCDSPS PG0/ETHERTXEN PG1/ETHERTXCLK PG2/LCDVD0 PG3/LCDVD1 PG4/LCDVD2 TYPE I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O DESCRIPTION General Purpose I/O Signal -- Port B7; multiplexed with UART0 Infrared Transmitted Serial Data Output, UART0 Serial Transmit Data Out, and External Interrupt 1. General Purpose I/O Signal -- Port C0; multiplexed with Address A16 General Purpose I/O Signal -- Port C1; multiplexed with Address A17 General Purpose I/O Signal -- Port C2; multiplexed with Address A18 General Purpose I/O Signal -- Port C3; multiplexed with Address A19 General Purpose I/O Signal -- Port C4; multiplexed with Address A20 General Purpose I/O Signal -- Port C5; multiplexed with Address A21 General Purpose I/O Signal -- Port C6; multiplexed with Address A22 and NAND Flash Write Enable General Purpose I/O Signal -- Port C7; multiplexed with Address A23 and NAND Flash Read Enable General Purpose I/O Signal -- Port D0; multiplexed with Data D8 General Purpose I/O Signal -- Port D1; multiplexed with Data D9 General Purpose I/O Signal -- Port D2; multiplexed with Data D10 General Purpose I/O Signal -- Port D3; multiplexed with Data D11 General Purpose I/O Signal -- Port D4; multiplexed with Data D12 General Purpose I/O Signal -- Port D5; multiplexed with Data D13 General Purpose I/O Signal -- Port D6; multiplexed with Data D14 General Purpose I/O Signal -- Port D7; multiplexed with Data D15 General Purpose I/O Signals -- Port E0; multiplexed with LCD Line Pulse and AD-TFT/HR-TFT Line Pulse General Purpose I/O Signals -- Port E1; multiplexed with LCD Data Clock General Purpose I/O Signals -- Port E2; multiplexed with LCD Power Save General Purpose I/O Signals -- Port E3; multiplexed with LCD Row Driver Clock General Purpose I/O Signals -- Port E4; multiplexed with LCD Panel Power Enable and LCD Reverse General Purpose I/O Signals -- Port E5; multiplexed with LCD VDD Enable General Purpose I/O Signals -- Port E6; multiplexed with LCD Analog Power Enable and MOD General Purpose I/O Signals -- Port E7; multiplexed with nWAIT and DMA End of Transfer General Purpose I/O Signals -- Port F0; multiplexed with LCD Video Data bit 6 General Purpose I/O Signals -- Port F1; multiplexed with LCD Video Data bit 7 General Purpose I/O Signals -- Port F2; multiplexed with LCD Video Data bit 8 General Purpose I/O Signals -- Port F3; multiplexed with LCD Video Data bit 9 General Purpose I/O Signals -- Port F4; multiplexed with LCD Video Data bit 10 General Purpose I/O Signals -- Port F5; multiplexed with LCD Video Data bit 11 General Purpose I/O Signals -- Port F6; multiplexed with LCD Start Pulse Left General Purpose I/O Signals -- Port F7; multiplexed with LCD Row Driver Counter reset General Purpose I/O Signals -- Port G0; multiplexed with Ethernet TX Enable General Purpose I/O Signals -- Port G1; multiplexed with Ethernet TX Clock General Purpose I/O Signals -- Port G2; multiplexed with LCD Video Data bit 0 General Purpose I/O Signals -- Port G3; multiplexed with LCD Video Data bit 1 General Purpose I/O Signals -- Port G4; multiplexed with LCD Video Data bit 2
Preliminary data sheet
Rev. 01 -- 16 July 2007
7
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 2. LH79524 Pin Descriptions (Cont'd)
LFBGA PIN A7 C8 B8 C4 A3 B4 C5 D6 A4 B5 C6 D3 B1 B2 D4 C3 A1 A2 B3 R16 M12 T16 R15 P13 R14 R13 N11 C1 C2 A10 C10 C12 A14 B14 C14 C11 A13 R12 SIGNAL NAME PG5/LCDVD3 PG6/LCDVD4 PG7/LCDVD5 PH0/ETHERRX3 PH1/ETHERRXDV PH2/ETHERRXCLK PH3/ETHERTXER PH4/ETHERTX0 PH5/ETHERTX1 PH6/ETHERTX2 PH7/ETHERTX3 PI0/ETHERMDC PI1/ETHERMDIO PI2/ETHERCOL PI3/ETHERCRS PI4/ETHERRXER PI5/ETHERRX0 PI6/ETHERRX1 PI7/ETHERRX2 PK0/D16 PK1/D17 PK2/D18 PK3/D19 PK4/D20 PK5/D21 PK6/D22 PK7/D23 PL0/LCDVD14 PL1/LCDVD15 PL2/LCDVD12 PL3/LCDVD13 PL4/D28 PL5/D29 PL6/D30 PL7/D31 PN0/D26 PN1/D27 PN2/D24 TYPE I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O DESCRIPTION General Purpose I/O Signals -- Port G5; multiplexed with LCD Video Data bit 3 General Purpose I/O Signals -- Port G6; multiplexed with LCD Video Data bit 4 General Purpose I/O Signals -- Port G7; multiplexed with LCD Video Data bit 5 General Purpose I/O Signals -- Port H0; multiplexed with Ethernet Receive Channel 3 General Purpose I/O Signals -- Port H1; multiplexed with Ethernet Data Valid General Purpose I/O Signals -- Port H2; multiplexed with Ethernet Receive Clock General Purpose I/O Signals -- Port H3; multiplexed with Ethernet Transmit Error General Purpose I/O Signals -- Port H4; multiplexed with Ethernet Transmit Channel 0 General Purpose I/O Signals -- Port H5; multiplexed with Ethernet Transmit Channel 1 General Purpose I/O Signals -- Port H6; multiplexed with Ethernet Transmit Channel 2 General Purpose I/O Signals -- Port H7; multiplexed with Ethernet Transmit Channel 3 General Purpose I/O Signals -- Port I0; multiplexed with Ethernet Management Data Clock General Purpose I/O Signals -- Port I1; multiplexed with Ethernet Management Data I/O General Purpose I/O Signals -- Port I2; multiplexed with Ethernet Collision Detect General Purpose I/O Signals -- Port I3; multiplexed with Ethernet Carrier Sense General Purpose I/O Signals -- Port I4; multiplexed with Ethernet Receive Error General Purpose I/O Signals -- Port I5; multiplexed with Ethernet Receive Channel 0 General Purpose I/O Signals -- Port I6; multiplexed with Ethernet Receive Channel 1 General Purpose I/O Signals -- Port I7; multiplexed with Ethernet Receive Channel 2 General Purpose I/O Signals -- Port K0; multiplexed with data bit D16 General Purpose I/O Signals -- Port K1; multiplexed with data bit D17 General Purpose I/O Signals -- Port K2; multiplexed with data bit D18 General Purpose I/O Signals -- Port K3; multiplexed with data bit D19 General Purpose I/O Signals -- Port K4; multiplexed with data bit D20 General Purpose I/O Signals -- Port K5; multiplexed with data bit D21 General Purpose I/O Signals -- Port K6; multiplexed with data bit D22 General Purpose I/O Signals -- Port K7; multiplexed with data bit D23 General Purpose I/O Signals -- Port L0; multiplexed with LCD Video Data bit 14 General Purpose I/O Signals -- Port L1; multiplexed with LCD Video Data bit 15 General Purpose I/O Signals -- Port L2; multiplexed with LCD Video Data bit 12 General Purpose I/O Signals -- Port L3; multiplexed with LCD Video Data bit 13 General Purpose I/O Signals -- Port L4; multiplexed with Data bit D28 General Purpose I/O Signals -- Port L5; multiplexed with Data bit D29 General Purpose I/O Signals -- Port L6; multiplexed with Data bit D30 General Purpose I/O Signals -- Port L7; multiplexed with Data bit D31 General Purpose I/O Signals -- Port N0; multiplexed with Data bit D26 General Purpose I/O Signals -- Port N1; multiplexed with Data bit D27 General Purpose I/O Signals -- Port N2; multiplexed with Data bit D24
8
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 2. LH79524 Pin Descriptions (Cont'd)
LFBGA PIN P11 J2 H1 C16 C15 D16 D15 K1 D2 P4 T3 T1 P3 T2 R3 E3 SIGNAL NAME PN3/D25 nRESETIN nRESETOUT XTALIN XTALOUT XTAL32IN XTAL32OUT CLKOUT nTRST TMS TCK TDI TDO TEST1 TEST2 LINREGEN TYPE I/O I O I O I O O I I I I O I I I DESCRIPTION General Purpose I/O Signals -- Port N3; multiplexed with Data bit D25 Reset Input Reset Output Crystal Input Crystal Output 32.768 kHz Crystal Oscillator Input 32.768 kHz Crystal Oscillator Output Clock Out (selectable from the internal bus clock or 32.768 kHz crystal) JTAG Test Reset Input JTAG Test Mode Select Input JTAG Test Clock Input JTAG Test Serial Data Input JTAG Test Data Serial Output Tie HIGH for Normal Operation; pull LOW to enable Embedded ICE Debugging Tie HIGH for Normal Operation; pull HIGH to enable Embedded ICE Debugging Linear Regulator Enable
D5, E4, E5, H13, VDDC N5 D10, F4, VSSC J13, N4 D7, D8, D9, F13, G4, G13, H4, VDD J4, K4, K13, L4, N6, N8, N9, N10 E12, G8, G9, H7, H8, H9, H10, J7, VSS J8, J9, J10, K8, K9, M5 D1 F16 E16 J1 F15 E15 VDDA0 VDDA1 VDDA2 VSSA0 VSSA1 VSSA2
Power Core Power Supply
Ground Core GND
Power Input/Output Power Supply
Ground Input/Output GND
Power Analog Power Supply for Analog-to-Digital Converter Power Analog Power Supply for the USB PLL Power Analog Power Supply for System PLL
Ground Analog GND for Analog-to-Digital Converter Ground Analog GND for the USB PLL Ground Analog GND for System PLL
Preliminary data sheet
Rev. 01 -- 16 July 2007
9
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 3. LH79524 Numerical Pin List
LFBGA NO. A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 C1 C2 C3 C4 C5 C6 C7 C8 C9 C10 C11 C12 FUNCTION AT RESET PI5 PI6 PH1 PH5 PG0 PG2 PG5 PF0 PF1 PL2 PF5 PF7 PN1 PL5 USBDP USBDN PI1 PI2 PI7 PH2 PH6 PG1 PG4 PG7 PF2 PF4 PF6 PE0 PE2 PL6 PE6 PE5 PL0 PL1 PI4 PH0 PH3 PH7 PG3 PG6 PF3 PL3 PN0 PL4 ETHERMDIO ETHERCOL ETHERRX2 ETHERRXCLK ETHERTX2 ETHERTXCLK LCDVD2 LCDVD5 LCDVD8 LCDVD10 LCDEN/LCDSPL LCDLP/LCDHRLP LCDPS D30 LCDVEEN/ LCDMOD LCDVDDEN LCDVD14 LCDVD15 ETHERRXER ETHERRX3 ETHERTXER ETHERTX3 LCDVD1 LCDVD4 LCDVD9 LCDVD13 D26 D28 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA MULTIPLEXED FUNCTION(S) ETHERRX0 ETHERRX1 ETHERRXDV ETHERTX1 ETHERTXEN LCDVD0 LCDVD3 LCDVD6 LCDVD7 LCDVD12 LCDVD11 LCDFP/LCDSPS D27 D29 OUTPUT DRIVE NOTES 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 1 1 1 1 1 2 1 1 1 3 3 2 1 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 1
Table 3. LH79524 Numerical Pin List (Cont'd)
LFBGA NO. C13 C14 C15 C16 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 E1 E2 E3 E4 E5 E12 E13 E14 E15 E16 F1 F2 F3 F4 F13 F14 F15 F16 G1 G2 G3 G4 G8 G9 FUNCTION AT RESET PE3 PL7 XTALOUT XTALIN VDDA0 nTRST PI0 PI3 VDDC PH4 VDD VDD VDD VSSC PE1 PE4 DQM0 PE7 XTAL32OUT XTAL32IN AN7 AN0/UL/X+ LINREGEN VDDC VDDC VSS DQM1 DQM2 VSSA2 VDDA2 AN5 AN1/UR/XAN6 VSSC VDD SDCLK VSSA1 VDDA1 AN9 AN2/LL/Y+ AN8 VDD VSS VSS PJ2 PJ3 PJ4 12 mA PJ7/INT7 PJ5/INT5 8 mA 8 mA PJ6/INT6 nWAIT/nDEOT LCDDCLK LCDDSPLEN/ LCDREV 8 mA 8 mA 8 mA 8 mA 2, 6 4 5 1 1 ETHERTX0 8 mA 1 ETHERMDC ETHERCRS 8 mA 8 mA 2, 6 1 1 MULTIPLEXED FUNCTION(S) LCDCLS D31 OUTPUT DRIVE NOTES 8 mA 8 mA 1 1 4 5
10
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 3. LH79524 Numerical Pin List (Cont'd)
LFBGA NO. G13 G14 G15 G16 H1 H2 H3 H4 H7 H8 H9 H10 H13 H14 H15 H16 J1 J2 J3 J4 J7 J8 J9 J10 J13 J14 J15 J16 K1 K2 K3 K4 K8 K9 K13 K14 K15 K16 L1 L2 L3 FUNCTION AT RESET VDD DQM3 SDCKE nDCS0 nRESETOUT AN3/LR/YPJ0 8 mA 8 mA 8 mA 8 mA MULTIPLEXED FUNCTION(S) OUTPUT DRIVE NOTES
Table 3. LH79524 Numerical Pin List (Cont'd)
LFBGA NO. L4 L13 L14 L15 L16 M1 M2 M3 FUNCTION AT RESET VDD D2 nCS3 nCS1 nCS0 PA3 PA1 PB7 PM3 PM1 PM0 CTCAP0B/ CTCMP0B INT3/UARTTX2/ UARTIRTX2 INT1/UARTTX0/ UARTIRTX0 SSPRX/I2SRXD/ UARTRX1/ UARTIRRX1 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1, 6 1, 6 1, 6 1 MULTIPLEXED FUNCTION(S) OUTPUT DRIVE NOTES
AN4/WIPER PJ1 VDD VSS VSS VSS VSS VDDC nDCS1 nRAS nCAS VSSA0 nRESETIN CTCLK VDD VSS VSS VSS VSS VSSC nBLE1 nBLE0 nWE CLKOUT PA7 PA6 VDD VSS VSS VDD nOE nBLE3 nBLE2 PA5 PA4 PA2 PM7 PM6 CTCAP1B/ CTCMP1B CTCAP1A/ CTCMP1A CTCAP0A/ CTCMP0A 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1, 6 1, 6 1, 6 P2 P3 P4 P5 P6 P7 PB2 TDO TMS PC6 PC3 A14 CTCAP2B/ CTCMP2B/SCL CTCAP2A/ CTCMP2A/SDA PM5 PM4 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 2, 6 2, 6 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 N15 N16 P1 PB6 PB3 VSSC VDDC VDD PC0 VDD VDD VDD PK7 PD4 PD2 D7 D4 D1 PB5 INT4/BATCNTL 8 mA 2, 6 2, 6 8 mA 8 mA 8 mA M5 M12 M13 M14 M15 M16 N1 VSS PK1 D6 D3 D0 nCS2 PA0 M4 PB4
8 mA
2
D17
8 mA 8 mA 8 mA 8 mA
1 1 1 1
PM2 INT2/UARTRX2/ UARTIRRX2 INT0/UARTRX0/ UARTIRRX0 SSPCLK/I2SCLK
8 mA 8 mA 8 mA 8 mA 1, 6 1, 6 1
A16
8 mA
1
D23 D12 D10
8 mA 8 mA 8 mA 8 mA 8 mA 8 mA
1 1 1 1 1 1 1 2
SSPTX/I2STXD/ UARTTX1/ UARTIRTX1 SSPFRM/I2SWS
8 mA 8 mA 4 mA
2, 6 A22/nFWE A19 8 mA 8 mA 8 mA 1 1
Preliminary data sheet
Rev. 01 -- 16 July 2007
11
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 3. LH79524 Numerical Pin List (Cont'd)
LFBGA NO. P8 P9 P10 P11 P12 P13 P14 P15 P16 R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 T1 T2 T3 FUNCTION AT RESET A11 A6 A3 PN3 PD6 PK4 PD1 PD0 D5 PB1 PB0 TEST2 PC7 PC4 PC1 A13 A10 A7 A4 A1 PN2 PK6 PK5 PK3 PK0 TDI TEST1 TCK D24 D22 D21 D19 D16 A23/nFRE A20 A17 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 2, 6 2, 6 2, 6 DREQ/ nUARTRTS0 nDACK/ nUARTCTS0 D25 D14 D20 D9 D8 MULTIPLEXED FUNCTION(S) OUTPUT DRIVE NOTES 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 1 2 2 2, 6 1 1 1
Table 3. LH79524 Numerical Pin List (Cont'd)
LFBGA NO. T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 FUNCTION AT RESET PC5 PC2 A15 A12 A9 A8 A5 A2 A0 PD7 PD5 PD3 PK2 D15 D13 D11 D18 MULTIPLEXED FUNCTION(S) A21 A18 OUTPUT DRIVE NOTES 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 1
NOTES: 1. Internal pull-down. The internal pullup and pulldown resistance on all digital I/O pins is 50K. 2. Internal pull-up. The internal pullup and pulldown resistance on all digital I/O pins is 50K. 3. USB Inputs/outputs are tristated. 4. Output is for crystal oscillator only, no drive capability. 5. Crystal Oscillator Inputs should be driven to a maximum of 1.8 V 10%. 6. Input with Schmitt Trigger. 7. Output Drive Values are MAX. See `DC Specifications'. 8. All unused analog pins, and XTAL32IN (if unused) should be tied to ground through a 33K resistor.
Table 4. TESTx PIN FUNCTION MODE Embedded ICE Normal TEST1 0 1 TEST2 1 1 nBLE0 1 x
12
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 5. LH79525 Pin Descriptions
PIN NO. 80 79 78 77 76 74 73 72 71 70 69 67 65 63 62 61 99 98 97 96 95 94 93 91 117 116 119 118 115 114 113 112 104 103 102 100 110 109 106 111 130 131 11 14 17 SIGNAL NAME A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 D0 D1 D2 D3 D4 D5 D6 D7 SDCLK SDCKE DQM0 DQM1 nDCS0 nDCS1 nRAS nCAS nCS0/PM0 nCS1/PM1 nCS2/PM2 nCS3/PM3 nBLE0/PM4 nBLE1/PM5 nOE nWE USBDN USBDP AN0/UL/X+ AN1/UR/X- AN2/LL/Y+/PJ3 O O O I/O I/O I I I Static Memory Byte Lane Enable / Byte Write Enable; multiplexed with GPIO Port M[5:4] Static Memory Output Enable Static Memory Write Enable USB Data Negative (Differential Pair output, single ended and Differential input) USB Data Positive (Differential Pair output, single ended and Differential input) ADC Input 0, 4 wire touch screen Upper Left, 5 wire touch screen X+ ADC Input 1, 4 wire touch screen Upper Right, 5 wire touch screen X- ADC Input 2, 4 wire touch screen Lower Left, 5 wire touch screen Y+; multiplexed with GPIO Port J3 (input only) O Static Memory Chip Select; multiplexed with GPO Port M[3:0] O O O O O O O SDRAM Clock SDRAM Clock Enable Data Mask Output to SDRAMs SDRAM Chip Select SDRAM Chip Select Row Address Strobe Column Address Strobe I/O External Data Bus O External Address Bus TYPE DESCRIPTION
Preliminary data sheet
Rev. 01 -- 16 July 2007
13
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 5. LH79525 Pin Descriptions (Cont'd)
PIN NO. 20 19 15 12 13 16 18 25 36 35 34 32 31 30 29 28 44 43 42 41 40 SIGNAL NAME AN3/LR/Y-/PJ0 AN4/WIPER/PJ1 AN5/PJ5/INT5 AN6/PJ7/INT7 AN7/PJ6/INT6 AN8/PJ4 AN9/PJ2 CTCLK/INT4/ BATCNTL PA0/UARTRX2/ UARTIRRX2/INT2 PA1/UARTTX2/ UARTIRRX2/INT3 PA2/CTCAP0A/ CTCMP0A PA3/CTCAP0B/ CTCMP0B PA4/CTCAP1A/ CTCMP1A PA5/CTCAP1B/ CTCMP1B PA6/CTCAP2A/ CTCMP2A/SDA PA7/CTCAP2B/ CTCMP2B/SLC PB0/nDACK/ nUARTCTS0 PB1/DREQ/ nUARTRTS0 PB2/SSPFRM/ I2SWS PB3/SSPCLK/ I2SCLK PB4/SSPRX/ I2SRXD/UARTRX1/ UARTIRRX1 PB5/SSPTX/ I2STXD/UARTTX1/ UARTIRTX1 PB6/INT0/ UARTRX0/ UARTIRRX0 PB7/INT1/ UARTTX0/ UARTIRTX0 PC0/A16 PC1/A17 PC2/A18 PC3/A19 PC4/A20 PC5/A21 TYPE I I I I I I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O DESCRIPTION ADC Input 3, 4 wire touch screen Upper Right, 5 wire touch screen Y-; multiplexed with GPIO Port J0 (input only) ADC Input 4, 5 wire touch screen Wiper input; multiplexed with Port J1 (input only) ADC Input 5; multiplexed with GPIO Port J5 (input only) and External Interrupt 5 ADC Input 6; multiplexed with GPIO Port J7 (input only) and External Interrupt 7 ADC Input 7; multiplexed with GPIO Port J6 (input only) and External Interrupt 6 ADC Input 8; multiplexed with GPIO Port J4 (input only) ADC Input 9; multiplexed with GPIO Port J2 (input only) Timer[2:0] External Clock input; multiplexed with Battery Control and Interrupt 4 General Purpose I/O Signal -- Port A0; multiplexed with UART2 Received Serial Data Input, UART2 Infrared Received Serial Data In, and External Interrupt 2 General Purpose I/O Signal -- Port A1; multiplexed with UART2 Transmitted Serial Data Output, UART2 Serial Transmit Data Out, and External Interrupt 3 General Purpose I/O Signal -- Port A2; multiplexed with Counter/Timer 0 Capture A input and Counter/Timer 0 Compare A output General Purpose I/O Signal -- Port A3; multiplexed with Counter/Timer 0 Capture B input and Counter/Timer 0 Compare B output General Purpose I/O Signal -- Port A4; multiplexed with Counter/Timer 1 Capture A input and Counter/Timer 1 Compare A output General Purpose I/O Signal -- Port A5; multiplexed with Counter/Timer 1 Capture B input and Counter/Timer 1 Compare B output General Purpose I/O Signal -- Port A6; multiplexed with Counter/Timer 2 Capture A input, Counter/Timer 2 Compare A output, and I2C Bus Data (open drain) General Purpose I/O Signal -- Port A7; multiplexed with Counter/Timer 2 Capture B input, Counter/Timer 2 Compare B output, and I2C Bus Clock (open drain) General Purpose I/O Signal -- Port B0; multiplexed with DMA Acknowledge and UART0 CTS General Purpose I/O Signal -- Port B1; multiplexed with DMA Request and UART0 RTS General Purpose I/O Signal -- Port B2; multiplexed with SSP Serial Frame Output and I2S Frame Output General Purpose I/O Signal -- Port B3; multiplexed with SSP Clock and I2S Clock General Purpose I/O Signal -- Port B4; multiplexed with SSP Data In, I2S Data In, UART1 Serial Data In, and UART1 Infrared Data In General Purpose I/O Signal -- Port B5; multiplexed with SSP Data Out, I2S Data Out, UART1 Data Out, and UART1 IR Data Out General Purpose I/O Signal -- Port B6; multiplexed with UART0 Infrared Received Serial Data Input, UART0 Received Serial Data In, and External Interrupt 0 General Purpose I/O Signal -- Port B7; multiplexed with UART0 Infrared Transmitted Serial Data Output, UART0 Serial Transmit Data Out, and External Interrupt 1 General Purpose I/O Signal -- Port C0; multiplexed with Address A16 General Purpose I/O Signal -- Port C1; multiplexed with Address A17 General Purpose I/O Signal -- Port C2; multiplexed with Address A18 General Purpose I/O Signal -- Port C3; multiplexed with Address A19 General Purpose I/O Signal -- Port C4; multiplexed with Address A20 General Purpose I/O Signal -- Port C5; multiplexed with Address A21
39
I/O
38
I/O
37 60 59 58 56 55 54
I/O I/O I/O I/O I/O I/O I/O
14
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 5. LH79525 Pin Descriptions (Cont'd)
PIN NO. 53 52 90 89 88 87 85 84 83 82 141 139 138 137 136 134 133 120 153 151 149 147 146 145 143 142 162 161 159 158 157 156 155 154 171 170 169 167 166 165 164 SIGNAL NAME PC6/A22/nFWE PC7/A23/nFRE PD0/D8 PD1/D9 PD2/D10 PD3/D11 PD4/D12 PD5/D13 PD6/D14 PD7/D15 PE0/LCDLP/ LCDHRLP PE1/LCDDCLK PE2/LCDPS PE3/LCDCLS PE4/LCDDSPLEN/ LCDREV PE5/LCDVDDEN PE6LCDVEEN/ LCDMOD PE7/nWAIT/nDEOT PF0/LCDVD6 PF1/LCDVD7 PF2/LCDVD8 PF3/LCDVD9 PF4/LCDVD10 PF5/LCDVD11 PF6/LCDEN/ LCDSPL PF7/LCDFP/ LCDSPS PG0/ETHERTXEN PG1/ETHERTXCLK PG2/LCDVD0 PG3/LCDVD1 PG4/LCDVD2 PG5/LCDVD3 PG6/LCDVD4 PG7/LCDVD5 PH0/ETHERRX3 PH1/ETHERRXDV PH2/ETHERRXCLK PH3/ETHERTXER PH4/ETHERTX0 PH5/ETHERTX1 PH6/ETHERTX2 TYPE I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O DESCRIPTION General Purpose I/O Signal -- Port C6; multiplexed with Address A22 and NAND Flash Write Enable General Purpose I/O Signal -- Port C7; multiplexed with Address A23 and NAND Flash Read Enable General Purpose I/O Signal -- Port D0; multiplexed with Data D8 General Purpose I/O Signal -- Port D1; multiplexed with Data D9 General Purpose I/O Signal -- Port D2; multiplexed with Data D10 General Purpose I/O Signal -- Port D3; multiplexed with Data D11 General Purpose I/O Signal -- Port D4; multiplexed with Data D12 General Purpose I/O Signal -- Port D5; multiplexed with Data D13 General Purpose I/O Signal -- Port D6; multiplexed with Data D14 General Purpose I/O Signal -- Port D7; multiplexed with Data D15 General Purpose I/O Signals -- Port E0; multiplexed with LCD Line Pulse and AD-TFT/HR-TFT Line Pulse General Purpose I/O Signals -- Port E1; multiplexed with LCD Data Clock General Purpose I/O Signals -- Port E2; multiplexed with LCD Power Save General Purpose I/O Signals -- Port E3; multiplexed with LCD Row Driver Clock General Purpose I/O Signals -- Port E4; multiplexed with LCD Panel Power Enable and LCD Reverse General Purpose I/O Signals -- Port E5; multiplexed with LCD VDD Enable General Purpose I/O Signals -- Port E6; multiplexed with LCD Analog Power Enable and MOD General Purpose I/O Signals -- Port E7; multiplexed with nWAIT and DMA End of Transfer General Purpose I/O Signals -- Port F0; multiplexed with LCD Video Data bit 6 General Purpose I/O Signals -- Port F1; multiplexed with LCD Video Data bit 7 General Purpose I/O Signals -- Port F2; multiplexed with LCD Video Data bit 8 General Purpose I/O Signals -- Port F3; multiplexed with LCD Video Data bit 9 General Purpose I/O Signals -- Port F4; multiplexed with LCD Video Data bit 10 General Purpose I/O Signals -- Port F5; multiplexed with LCD Video Data bit 11 General Purpose I/O Signals -- Port F6; multiplexed with LCD Start Pulse Left General Purpose I/O Signals -- Port F7; multiplexed with LCD Row Driver Counter reset General Purpose I/O Signals -- Port G0; multiplexed with Ethernet Transmit Enable General Purpose I/O Signals -- Port G1; multiplexed with Ethernet Clock General Purpose I/O Signals -- Port G2; multiplexed with LCD Video Data bit 0 General Purpose I/O Signals -- Port G3; multiplexed with LCD Video Data bit 1 General Purpose I/O Signals -- Port G4; multiplexed with LCD Video Data bit 2 General Purpose I/O Signals -- Port G5; multiplexed with LCD Video Data bit 3 General Purpose I/O Signals -- Port G6; multiplexed with LCD Video Data bit 4 General Purpose I/O Signals -- Port G7; multiplexed with LCD Video Data bit 5 General Purpose I/O Signals -- Port H0; multiplexed with Ethernet Receive Channel 3 General Purpose I/O Signals -- Port H1; multiplexed with Ethernet Data Valid General Purpose I/O Signals -- Port H2; multiplexed with Ethernet Receive Clock General Purpose I/O Signals -- Port H3; multiplexed with Ethernet Transmit Error General Purpose I/O Signals -- Port H4; multiplexed with Ethernet Transmit Channel 0 General Purpose I/O Signals -- Port H5; multiplexed with Ethernet Transmit Channel 1 General Purpose I/O Signals -- Port H6; multiplexed with Ethernet Transmit Channel 2
Preliminary data sheet
Rev. 01 -- 16 July 2007
15
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 5. LH79525 Pin Descriptions (Cont'd)
PIN NO. 163 4 2 1 176 175 174 173 172 24 22 127 128 125 126 23 8 50 51 46 45 47 48 9 SIGNAL NAME PH7/ETHERTX3 PI0/ETHERMDC PI1/ETHERMDIO PI2/ETHERCOL PI3/ETHERCRS PI4/ETHERRXER PI5/ETHERRX0 PI6/ETHERRX1 PI7/ETHERRX2 nRESETIN nRESETOUT XTALIN XTALOUT XTAL32IN XTAL32OUT CLKOUT nTRST TMS TCK TDI TDO TEST1 TEST2 LINREGEN TYPE I/O I/O I/O I/O I/O I/O I/O I/O I/O I O I O I O O I I I I O I I I DESCRIPTION General Purpose I/O Signals -- Port H7; multiplexed with Ethernet Transmit Channel 3 General Purpose I/O Signals -- Port I0; multiplexed with Ethernet Management Data Clock General Purpose I/O Signals -- Port I1; multiplexed with Ethernet Management Data I/O General Purpose I/O Signals -- Port I2; multiplexed with Ethernet Collision Detect General Purpose I/O Signals -- Port I3; multiplexed with Ethernet Carrier Sense General Purpose I/O Signals -- Port I4; multiplexed with Ethernet Receive Error General Purpose I/O Signals -- Port I5; multiplexed with Ethernet Receive Channel 0 General Purpose I/O Signals -- Port I6; multiplexed with Ethernet Receive Channel 1 General Purpose I/O Signals -- Port I7; multiplexed with Ethernet Receive Channel 2 Reset Input Reset Output Crystal Input, or external clock input Crystal Output 32.768 kHz Crystal Oscillator Input, or external clock input, 32.768 kHz Crystal Oscillator Output Clock Out (selectable from the internal bus clock or 32.768 MHz) JTAG Test Reset Input JTAG Test Mode Select Input JTAG Test Clock Input JTAG Test Serial Data Input JTAG Test Data Serial Output Tie HIGH for Normal Operation; pull LOW to enable embedded ICE Debugging Tie HIGH for Normal Operation; pull HIGH to enable embedded ICE Debugging Linear Regulator Enable (Requires pull-up. See User's Guide)
6, 66, VDDC 107, 150 7, 64, VSSC 105,148 3, 26, 33, 57, 75, 86, 101, VDD 129, 135, 144, 160 5, 27, 49, 68, 81, 92, 108, VSS 132, 140, 152, 168 10 122 123 21 121 124 VDDA0 VDDA1 VDDA2 VSSA0 VSSA1 VSSA2
Power Core Power Supply Ground Core GND
Power Input/Output Power Supply
Ground Input/Output GND
Power Analog Power Supply for Analog-to-Digital Converter Power Analog Power Supply for the USB PLL Power Analog Power Supply for System PLL Ground Analog GND for Analog-to-Digital Converter Ground Analog GND for the USB PLL Ground Analog GND for System PLL
Table 6. LH79525 Numerical Pin List
PIN NO. 1 FUNCTION AT RESET PI2 MULTIPLEXED FUNCTION(S) ETHERCOL OUTPUT NOTES DRIVE 8 mA 1
Table 6. LH79525 Numerical Pin List (Cont'd)
PIN NO. 2 FUNCTION AT RESET PI1 MULTIPLEXED FUNCTION(S) ETHERMDIO OUTPUT NOTES DRIVE 8 mA 2
16
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 6. LH79525 Numerical Pin List (Cont'd)
PIN NO. 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 FUNCTION AT RESET VDD PI0 VSS VDDC VSSC nTRST LINREGEN VDDA0 AN0/UL/X+ AN6 AN7 AN1/UR/XAN5 AN8 AN2/LL/Y+ AN9 AN3/LR/YVSSA0 nRESETOUT CLKOUT nRESETIN CTCLK VDD VSS PA7 PA6 PA5 PA4 PA3 VDD PA2 PA1 PA0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 PB0 TDO TDI CTCAP0A/CTCMP0A INT3/UARTTX2/ UARTIRTX2 INT2/UARTRX2/ UARTIRRX2 INT1/UARTTX0/ UARTIRTX0 INT0/UARTRX0/ UARTIRRX0 SSPTX/I2STXD/ UARTTX1/UARTIRTX1 SSPRX/I2SRXD/ UARTRX1/UARTIRRX1 SSPCLK/I2SCLK SSPFRM/I2SWS DREQ/nUARTRTS0 nDACK/nUARTCTS0 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 4 mA 2, 3 1, 3 1, 3 1, 3 1, 3 1, 3 1 2 1 2 2 2 CTCAP2B/CTCMP2B/ SCL CTCAP2A/CTCMP2A/ SDA CTCAP1B/CTCMP1B CTCAP1A/CTCMP1A CTCAP0B/CTCMP0B 8 mA 8 mA 8 mA 8 mA 8 mA 2, 3 2, 3 1, 3 1, 3 1, 3 INT4/BATCNTL 8 mA 8 mA 8 mA 2, 3 2, 3 PJ5/INT5 PJ4 PJ3 PJ2 PJ0 PJ7/INT7 PJ6/INT6 2, 3 ETHERMDC 8 mA 1 MULTIPLEXED FUNCTION(S) OUTPUT NOTES DRIVE
Table 6. LH79525 Numerical Pin List (Cont'd)
PIN NO. 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 FUNCTION AT RESET TEST1 TEST2 VSS TMS TCK PC7 PC6 PC5 PC4 PC3 VDD PC2 PC1 PC0 A15 A14 A13 VSSC A12 VDDC A11 VSS A10 A9 A8 A7 A6 A5 VDD A4 A3 A2 A1 A0 VSS PD7 PD6 PD5 PD4 VDD PD3 PD2 PD1 PD0 D7 VSS D6 D5 D4 D3 8 mA 8 mA 8 mA 8 mA 1 1 1 1 D11 D10 D9 D8 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 D15 D14 D13 D12 8 mA 8 mA 8 mA 8 mA 1 1 1 1 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA A18 A17 A16 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 A23/nFRE A22/nFWE A21 A20 A19 8 mA 8 mA 8 mA 8 mA 8 mA 2, 3 2, 3 1 1 1 1 1 MULTIPLEXED FUNCTION(S) OUTPUT NOTES DRIVE 2, 3 2, 3
AN4/WIPER PJ1
Preliminary data sheet
Rev. 01 -- 16 July 2007
17
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 6. LH79525 Numerical Pin List (Cont'd)
PIN NO. 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 FUNCTION AT RESET D2 D1 D0 nCS3 VDD nCS2 nCS1 nCS0 VSSC nOE VDDC VSS nBLE1 nBLE0 nWE nCAS nRAS nDCS1 nDCS0 SDCKE SDCLK DQM1 DQM0 PE7 VSSA1 VDDA1 VDDA2 VSSA2 XTAL32IN XTAL32OUT XTALIN XTALOUT VDD USBDN USBDP VSS PE6 PE5 VDD PE4 PE3 PE2 PE1 VSS PE0 PF7 PF6 VDD PF5 LCDVD11 8 mA 2 LCDLP/LCDHRLP LCDFP/LCDSPS LCDEN/LCDSPL 8 mA 8 mA 8 mA 1 1 1 LCDDSPLEN/LCDREV LCDCLS LCDPS LCDDCLK 8 mA 8 mA 8 mA 8 mA 1 1 1 1 LCDVEEN/ LCDMOD LCDVDDEN 8 mA 8 mA 1 1 4 4 5 6 5 6 nWAIT/nDEOT PM5 PM4 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 12 mA 8 mA 8 mA 8 mA 2, 3 8 mA PM2 PM1 PM0 8 mA 8 mA 8 mA PM3 MULTIPLEXED FUNCTION(S) OUTPUT NOTES DRIVE 8 mA 8 mA 8 mA 8 mA 1 1 1
Table 6. LH79525 Numerical Pin List (Cont'd)
PIN NO. 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 FUNCTION AT RESET PF4 PF3 VSSC PF2 VDDC PF1 VSS PF0 PG7 PG6 PG5 PG4 PG3 PG2 VDD PG1 PG0 PH7 PH6 PH5 PH4 PH3 VSS PH2 PH1 PH0 PI7 PI6 PI5 PI4 PI3 ETHERRXCLK ETHERRXDV ETHERRX3 ETHERRX2 ETHERRX1 ETHERRX0 ETHERRXER ETHERCRS 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 1 1 1 ETHERTXCLK ETHERTXEN ETHERTX3 ETHERTX2 ETHERTX1 ETHERTX0 ETHERTXER 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 1 1 LCDVD6 LCDVD5 LCDVD4 LCDVD3 LCDVD2 LCDVD1 LCDVD0 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 8 mA 1 1 1 1 1 1 1 LCDVD7 8 mA 1 LCDVD8 8 mA 2 MULTIPLEXED FUNCTION(S) LCDVD10 LCDVD9 OUTPUT NOTES DRIVE 8 mA 8 mA 2 2
NOTES: 1. Internal pull-down. The internal pullup and pulldown resistance on all digital I/O pins is 50K. 2. Internal pull-up. The internal pullup and pulldown resistance on all digital I/O pins is 50K. 3. Input with Schmitt Trigger. 4. USB Inputs/outputs are tristated. 5. Crystal Inputs should be driven to a maximum of 1.8 V 10%. 6. Output is for crystal oscillator only, no drive capability. 7. Output Drive Values shown are MAX. See `DC Specifications'. 8. All unused analog pins, and XTAL32IN (if unused) should be tied to ground through a 33K resistor.
18
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 7. TESTx PIN FUNCTION
MODE Embedded ICE Normal TEST1 0 1 TEST2 1 1 nBLE0 1 x
Table 8. LH79524 LCD Data Multiplexing
STN LFBGA BALL NO.
C2 C1 C10 A10 A11 B10 C9 B9 A9 A8 B8 C8 A7 B7 C7 A6
TFT COLOR SINGLE PANEL
CUSTN0 X CUSTN6 X X X X X X X CUSTN7 CUSTN5 CUSTN4 CUSTN3 CUSTN2 CUSTN1
LFBGA BALL NAME
MONO 4-BIT SINGLE PANEL
MUSTN0 X X X X X X X X X X X X MUSTN3 MUSTN2 MUSTN1
MONO 8-BIT SINGLE PANEL
MUSTN0 X MUSTN6 X X X X X X X MUSTN7 MUSTN5 MUSTN4 MUSTN3 MUSTN2 MUSTN1
COLOR SINGLE PANEL
INTENSITY BLUE4 BLUE3 BLUE2 BLUE1 BLUE0 GREEN4 GREEN3 GREEN2 GREEN1 GREEN0 RED4 RED3 RED2 RED1 RED0
DUAL PANEL
MUSTN0 X X X X X MLSTN3 MLSTN2 MLSTN1 MLSTN0 X X X MUSTN3 MUSTN2 MUSTN1
DUAL PANEL
MUSTN0 MLSTN4 MUSTN6 MLSTN7 MLSTN6 MLSTN5 MLSTN3 MLSTN2 MLSTN1 MLSTN0 MUSTN7 MUSTN5 MUSTN4 MUSTN3 MUSTN2 MUSTN1
DUAL PANEL
CUSTN0 CLSTN4 CUSTN6 CLSTN7 CLSTN6 CLSTN5 CLSTN3 CLSTN2 CLSTN1 CLSTN0 CUSTN7 CUSTN5 CUSTN4 CUSTN3 CUSTN2 CUSTN1
LCDVD15 LCDVD14 LCDVD13 LCDVD12 LCDVD11 LCDVD10 LCDVD9 LCDVD8 LCDVD7 LCDVD6 LCDVD5 LCDVD4 LCDVD3 LCDVD2 LCDVD1 LCDVD0
NOTES: 1. Recommended hookups for TFT 5:5:5 + Intensity and 5:6:5 are shown. 2. The Intensity bit is identically generated for all three colors. 3. Connect to the LSB of the Red, Green, and Blue inputs of a 6:6:6 panel. 4. CLSTN = Color Lower data bit for STN panel. 5. CUSTN = Color Upper data bit for STN panel. 6. MLSTN = Monochrome Lower data bit for STN panel. 7. MUSTN = Monochrome Upper data bit for STN panel.
Table 9. LH79525 LCD Data Multiplexing
PIN NO. 145 146 147 149 151 153 154 155 156
PIN NAME
STN MONO 4-BIT SINGLE PANEL MUSTN1 MUSTN0 DUAL PANEL MUSTN1 MUSTN0
LCDVD11 LCDVD10 LCDVD9 LCDVD8 LCDVD7 LCDVD6 LCDVD5 LCDVD4 LCDVD3
MLSTN3 MLSTN2 MLSTN1 MLSTN0
Preliminary data sheet
Rev. 01 -- 16 July 2007
19
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 9. LH79525 LCD Data Multiplexing
PIN NO. 157 158 159
PIN NAME
STN MONO 4-BIT SINGLE PANEL MUSTN3 MUSTN2 DUAL PANEL MUSTN3 MUSTN2
LCDVD2 LCDVD1 LCDVD0
LCD
TOUCH SCREEN
WIRELESS ROUTER/ SWITCHER
ETHERNET TRANSCEIVER ETHERNET MAC UART STN/TFT, AD-TFT
A/D FLASH
CODEC
I 2S
LH79524/LH79525
SRAM or SDRAM
A/D UART USB SENSOR ARRAY
1 4 7 2 5 8 0
GPIO
SSP
BOOT ROM
3 6 9 #
*
SERIAL EEPROM
KEY MATRIX
LH79525-19A
Figure 4. LH79524/LH79525 Application Diagram Example The LH79524/LH79525 MMU allows mapping Physical Memory (PA) addresses to virtual memory addresses. This allows physical memory, which is constrained by hardware to specific addresses, to be reorganized at addresses identified by the user. These user identified locations are called Virtual Addresses (VA). When the MMU is enabled, Code and Data must be built, loaded, and executed using Virtual Addresses which the MMU translates to Physical Addresses. In addition, the user may implement a memory protection scheme by using the features of the MMU. Address translation and memory protection services provided by the MMU are controlled by the user. The MMU is directly controlled through the System Control Coprocessor, Coprocessor 15 (CP15). The MMU is indirectly controlled by a Translation Table (TT) and Page Tables (PT) prepared by the user and established using a portion of physical memory dedicated by the user to storing the TT and PT's.
SYSTEM DESCRIPTIONS ARM720T Processor
The LH79524/LH79525 microcontrollers feature the ARM720T cached core with an Advanced High-Performance Bus (AHB) interface. The ARM720T features: * 32-bit ARM720T RISC Core * 8 kB Cache * MMU (Windows CE enabled) The core processor for both is a member of the ARM7T family of processors. For more information, see the ARM document, `ARM720T (Rev 3) Technical Reference Manual', available on ARM's website at www.ARM.com.
20
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
External Memory Controller
An integrated External Memory Controller (EMC) provides a glueless interface to external SDRAM, Low Power SDRAM, Flash, SRAM, ROM, and burst ROM. Three remap options for the physical memory are selectable by software, as shown in Figure 5 through Figure 8. The EMC supports six banks of external memory. Two chip selects for synchronous memory, and either two (LH79525) or four (LH79524) static memory chip selects are available. The static interface also includes two (LH79525) or four (LH79524) byte lane enable signals.
0xFFFFFFFF 0xFFFF1000 0xFFFF0000 ADVANCED PERIPHERAL BUS PERIPHERALS 0xFFFC0000 RESERVED 0xA0000000 BOOT ROM 0x80000000 16KB INTERNAL SRAM 0x60000000 EXTERNAL STATIC MEMORY 0xFFFFFFFF 0xFFFF1000 0xFFFF0000 ADVANCED PERIPHERAL BUS PERIPHERALS 0xFFFC0000 RESERVED 0xA0000000 BOOT ROM 0x80000000 16KB INTERNAL SRAM 0x60000000 EXTERNAL STATIC MEMORY 0x40000000 EXTERNAL SDRAM 0x20000000 EXTERNAL SRAM nCS1 0x00000000 REMAP = 00 0xA0000000
LH79525-15 LH79525-16
ADVANCED HIGH-PERFORMANCE BUS PERIPHERALS RESERVED
ADVANCED HIGH-PERFORMANCE BUS PERIPHERALS RESERVED
0x40000000 EXTERNAL SDRAM 0x20000000 EXTERNAL SDRAM nDCS0 0x00000000 REMAP = 01
Figure 6. Memory Remap `01'
0xFFFFFFFF 0xFFFF1000 0xFFFF0000 ADVANCED PERIPHERAL BUS PERIPHERALS 0xFFFC0000 RESERVED BOOT ROM 0x80000000 16KB INTERNAL SRAM 0x60000000 EXTERNAL STATIC MEMORY 0x40000000 EXTERNAL SDRAM 0x20000000 INTERNAL SRAM 0x00000000 REMAP = 10
LH79525-17
ADVANCED HIGH-PERFORMANCE BUS PERIPHERALS RESERVED
Figure 5. Memory Remap `00'
Figure 7. Memory Remap `10'
Preliminary data sheet
Rev. 01 -- 16 July 2007
21
LH79524/LH79525
NXP Semiconductors
System-on-Chip
* Supports Thin Film Transistor (TFT) color displays * Programmable resolution up to 1,024 x 1,024
0xFFFFFFFF 0xFFFF1000 0xFFFF0000 ADVANCED PERIPHERAL BUS PERIPHERALS 0xFFFC0000 RESERVED 0xA0000000 BOOT ROM 0x80000000 16KB INTERNAL SRAM 0x60000000 EXTERNAL STATIC MEMORY 0x40000000 EXTERNAL SDRAM 0x20000000 EXTERNAL SRAM nCS0 0x00000000 REMAP = 11
LH79525-18
ADVANCED HIGH-PERFORMANCE BUS PERIPHERALS RESERVED
* 15 gray-level mono, 3,375 color STN, and 64 k color TFT support * 1, 2, or 4 bits-per-pixel (BPP) for monochrome STN * 1-, 2-, 4-, or 8-BPP palettized color displays for color STN and TFT (1-, 2-, or 4-bit only on LH79525) * True-color non-palettized, for color STN and TFT * Programmable timing for different display panels * 256-entry, 16-bit palette fast-access RAM * Frame, line and pixel clock signals * AC bias signal for STN or data enable signal for TFT panels * Patented grayscale algorithm * Interrupt Generation Events * Dual 16-deep programmable 32-bit wide FIFOs for buffering incoming data. ADVANCED LCD INTERFACE The Advanced LCD Interface (ALI) allows for direct connection to ultra-thin panels that do not include a timing ASIC. It converts TFT signals from the Color LCD controller to provide the proper signals, timing and levels for direct connection to a panel's Row and Column drivers for AD-TFT, HR-TFT, or any technology of panel that allows for a connection of this type. The Advanced LCD Interface peripheral also provides a bypass mode that allows the LH79524/LH79525 to interface to the built-in timing ASIC in standard TFT and STN panels.
Figure 8. Memory Remap `11'
DMA Controller
The DMA Controller provides support for DMA-capable peripherals. The LCD controller uses its own DMA port, connecting directly to memory for retrieving display data. * Simultaneous servicing of up to 4 data streams * Three transfer modes are supported: - Memory to Memory - Peripheral to Memory - Memory to Peripheral * Identical source and destination capabilities * Transfer Size Programmable (byte, half-word, word) * Burst Size Programmable * Address Increment or Address Freeze * Transfer Error interrupt for each stream * 16-word FIFO array with pack and unpack logic Handles all combinations of byte, half-word or word transfers from input to output.
Synchronous Serial Port (SSP)
The SSP is a master or slave interface for synchronous serial communication with master or slave peripheral devices that support protocols for Motorola SPI, National Semiconductor MICROWIRE, or Texas Instruments Synchronous Serial Interface. * Master or slave operation * Programmable clock rate * Separate transmit FIFO and receive FIFO buffers, 16 bits wide, 8 locations deep * DMA for transmit and receive * Programmable interface protocols: Motorola SPI, National Semiconductor MICROWIRE, or Texas Instruments Synchronous Serial Port * Programmable data frame size from 4 to 16 bits * Independent masking of transmit FIFO, receive FIFO and receive overrun interrupts * Available internal loopback test mode.
Color LCD Controller (CLCDC)
The CLCDC provides all the necessary control and drive signals to interface directly with a variety of color and monochrome LCD panels. * LH79524 has 16 LCD Data bits; LH79525 has 12 LCD Data bits. * Supports single and dual scan color and monochrome Super Twisted Nematic (STN) displays with 4- or 8-bit interfaces (LH79524 only)
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Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Universal Asynchronous Receiver Transmitter (UART)
The LH79524/LH79525 incorporates three UARTs. UART0, UART1, and UART2 offer similar functionality to the industry-standard 16C550. They perform serialto-parallel conversion on data received from a peripheral device and parallel-to-serial conversion on data transmitted to the UART. The CPU reads and writes data and control status information through the AMBA APB interface. The transmit and receive paths are buffered with internal FIFO memories that support programmable-service 'trigger levels', and overrun protection. These FIFO memories enable up to 32 characters to be stored independently in both transmit and receive modes. * Programmable bits-per-character (5, 6, 7, or 8) * Optional nine-bit mode to tag and recognize characters as either data or address * Nine-bit Transmit FIFO and 12-bit Receive FIFO * Programmable FIFO trigger points * DMA support for UART0 * Programmable IrDA SIR input/output for each UART * Separate 16-byte transmit and receive FIFOs to reduce CPU interrupts * Programmable FIFO disabling for 1-byte depth * Programmable baud rate generator * Independent masking of transmit FIFO, receive FIFO, receive timeout and modem status interrupts * False start bit detection * Line break generation and detection * Fully-programmable serial interface characteristics: - 5-, 6-, 7-, or 8-bit data word length - Even-, odd-, or no-parity bit generation and detection - 1 or 2 stop bit generation * IrDA SIR Encode/Decode block, providing: - Programmable use of IrDA SIR or UART input/ output - Supports data rates up to 115.2 kbit/s half-duplex - Programmable internal clock generator, allowing division of the Reference clock in increments of 1 to 512 for low-power mode bit durations. - Loopback for testing
interrupt vector logic with programmable priority for up to 16 interrupt sources. This logic reduces the interrupt response time for IRQ type interrupts compared to solutions using software polling to determine the highest priority interrupt source. This significantly improves the real-time capabilities of the LH79524/LH79525 in embedded control applications. * 20 internal and eight external interrupt sources - Individually maskable - Status accessible for software polling * IRQ interrupt vector logic for up to 16 channels with programmable priorities * All of the interrupt channels, with the exception of the Watchdog Timer interrupt, can be programmed to generate: - FIQ interrupt request - Non-vectored IRQ interrupt request (software to poll IRQ source) - Vectored IRQ interrupt request (up to 16 channels total) * The Watchdog timer can only generate FIQ interrupt requests * External interrupt inputs programmable - Edge triggered or level triggered - Rising edge/active HIGH or falling edge/active LOW The 32 interrupt channels are shown in Table 10. Table 10. Interrupt Channels
CHANNEL 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 WDT Not Used COMRX (used for debug) COMTX (used for debug) Counter/Timer0 Combined Counter/Timer1 Combined Counter/Timer2 Combined External Interrupt 0 External Interrupt 1 External Interrupt 2 External Interrupt 3 External Interrupt 4 External Interrupt 5 External Interrupt 6 External Interrupt 7 RTC_ALARM ACD TSIRQ Combined ADC Brown Out INTR INTERRUPT SOURCE
Vectored Interrupt Controller (VIC)
The Vectored Interrupt Controller combines the interrupt request signals from 20 internal and eight external interrupt sources and applies them, after masking and prioritization, to the IRQ and FIQ interrupt inputs of the ARM7TDMI processor core. The Interrupt Controller incorporates a hardware
Preliminary data sheet
Rev. 01 -- 16 July 2007
23
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 10. Interrupt Channels (Cont'd)
CHANNEL 18 19 20 21 22 23 24 25 26 27 28 29 30 31 INTERRUPT SOURCE ADC Pen IRQ CLCD Combined Interrupt DMA Stream 0 DMA Stream 1 DMA Stream 2 DMA Stream 3 SSP I S Interrupt Ethernet Interrupt USB Interrupt UART 0 Interrupt UART 1 Interrupt UART 2 Interrupt USB DMA Interrupt I
2C 2
Table 11. Maximum Clock Speeds
NAME Oscillator Clock (CLK OSC) PLL System Clock (CLK PLL) PLL USB Clock 32.768 kHz Oscillator Clock AHB Clock (HCLK) AHB Fast CPU Clock (FCLK CPU) Ethernet Clock DMA Clock External Memory Controller Clock SSP Clock CLCD Clock UART[2:0] Clock RTC Clock FREQUENCY (MAX.) 20.0 MHz 304.819 MHz 48.0 MHz 32.768 kHz 50.803 MHz 76.205 MHz 50.803 MHz 50.803 MHz 50.803 MHz 50.803 MHz 50.803 MHz 20.0 MHz 1.0 Hz
Interrupt
Reset, Clock, and Power Controller (RCPC)
The RCPC generates the various clock signals for the operation of the LH79524/LH79525 and provides for an orderly start-up after power-on and during a wake-up from one of the power saving operating modes. The RCPC allows the software to individually select the frequency of the various on-chip clock signals as required to operate the chip in the most power-efficient mode. The maximum speeds of the various clocks in the SoC are shown in Table 11. More detailed descriptions of each clock appear in the User's Guide. The RCPC features: * 10 - 20 MHz crystal oscillator and PLL for on-chip Clock generation (11.2896 MHz recommended) * External Clock input if on-chip oscillator and PLL are not used * 32.768 kHz crystal oscillator generating 1 Hz clock for Real Time Clock * Individually controlled clocks for peripherals and CPU * Programmable clock prescalers for UARTs and PWMs * Five global power control modes are available: - Active - Standby - Sleep - Stop1 - Stop2 * CPU/Bus clock frequency can be changed on the fly * Selectable clock output * Hardware reset (nRESETIN) and software reset.
Table 12. Clock Activity for Different Power Modes
DEVICE RTC 32 kHz Oscillator 10 - 20 MHz Oscillator PLL Peripheral Clock CPU Clock ACTIVE STANDBY SLEEP STOP1 STOP2 ON ON ON ON ON ON ON ON ON OFF ON ON ON OFF OFF ON ON OFF OFF OFF ON OFF OFF OFF OFF
Real Time Clock
The RTC provides an alarm or long time base counter. An interrupt is generated following counting a programmed number of one-second periods. The 1 Hz RTC clock is internally derived. The RTC features: * 32-bit up counter with programmable load * Programmable 32-bit match compare register * Software maskable interrupt when counter and compare registers are identical. RTC input clock sources: * PLL clock * 32.768 kHz clock * 1 Hz clock (default).
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Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Watchdog Timer
The Watchdog Timer provides hardware protection against malfunctions. It is a programmable timer to be reset by software at regular intervals. Failure to reset the timer will cause a FIQ interrupt. Failure to service the FIQ interrupt will then generate a System Reset. The features of the Watchdog Timer are: * Driven by the bus clock * 16 programmable time-out periods: 216 through 231 clock cycles * Generates a reset or an FIQ Interrupt whenever a time-out period is reached * Software enable, lockout, and counter-reset mechanisms add security against inadvertent writes * Protection mechanism guards against interrupt-service failure: - The first WDT time-out triggers FIQ and asserts nWDFIQ status flag - If FIQ service routine fails to clear nWDFIQ, then the next WDT time-out triggers a system reset.
General Purpose Input/Output (GPIO)
The LH79524 provides up to 108 bits of programmable input/output, and the LH79525 provides 86 bits. Many of the GPIO pins are multiplexed with other signals. All GPIO feature: * Individually programmable input/output pins * All default to Input on power-up. * LH79524 - Ports A-I, K, L, and N: Bidirectional I/O (Port N is 4 bits wide) - Port J: Input only - Port M: Output only * LH79525 - Ports A-I: Bidirectional I/O - Port J: Input only - Port M: Output only (6 bits wide)
Boot Controller
The boot controller allows selection of the hardware device to be used for booting. * Supports booting from 8-, 16-, or 32-bit devices, selectable via external pins at power-on reset * Configures the byte lane boot state for nCS1, selectable via external pins at power-on reset. * Supports booting from alternate external devices (e.g., NAND flash) via external pins on power-on reset * Glueless interface to external NAND flash.
Timers
The LH79524 and LH79525 incorporate three 16-bit independently programmable Timer modules. The timers are clocked by the system clock, but have an internal scaled-down system clock that is used for the Pulse Width Modulator (PWM) and compare functions. All counters are incremented by an internal prescaled counter clock or external clock and can generate an overflow interrupt. All three timers have separate internal prescaled counter clocks, with either a common external clock or a prescaled version of the system clock. * Timer 0 has five Capture Registers and two Compare Registers. * Timer 1 and Timer 2 have two Capture and two Compare Registers each. The Capture Registers have edge-selectable inputs and can generate an interrupt. The Compare Registers can force the compare output pin either HIGH or LOW upon a match. The timers support a PWM Mode that uses the two Timer Compare Registers associated with a timer to create a PWM. Each timer can generate a separate interrupt. The interrupt becomes active if any enabled compare, capture, or overflow interrupt condition occurs. The interrupt remains active until all compare, capture, and overflow interrupts are cleared.
USB Device
The USB Device integrated into the LH79524/ LH79525 is compliant with the USB 1.1 and 2.0 specification, and compatible with both the OpenHCI and Intel UHCI standards. The USB Device: * Supports Full-Speed (12 Mbit/s) operation, and suspend and resume signaling * Four Endpoints * Bulk/Interrupt or Isochronous Transfers * FIFO for each Endpoint direction (except EP0 which shares a FIFO between IN/OUT). FIFOs exist in 2464 x 8 RAM * Supports DMA accesses to FIFO.
Preliminary data sheet
Rev. 01 -- 16 July 2007
25
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Ethernet MAC Controller
The on-board Ethernet MAC Controller (EMAC) is compatible with IEEE 802.3, and has passed the University of New Hampshire (UNH) testing. It supports both 10- and 100-Mbit/s, and full and half duplex operation. Other features include: * Statistics counter registers for RMON/MIB * MII interface to the physical layer * Interrupt generation to signal receive and transmit completion * Transmit and receive FIFOs * Automatic pad and CRC generation on transmitted frames * Automatic discard of frames received with errors * Address checking logic supports up to four specific (hardware) 48-bit addresses * Supports promiscuous mode where received frames are copied to memory all valid
SSP To I2S Converter
The SSP to I2S converter is an interface that converts a synchronous serial communication stream in TI DSP-compatible mode into an I2S compliant synchronous serial stream. The I 2 S converter operates on serial data in both master and slave mode. The I2S converter provides: * Programmable Word Select (WS) delay * Left/right channel information: - Current WS value at the pin - WS value associated with next entry written to TX FIFO - WS value associated with next entry read from RX FIFO * Ability to invert WS state * Ability to invert the bit clock * Supports frame size of 16 bits only. Any other frame size will result in a frame size error. Each frame transmits starting with the most-significant bit. * Master and slave modes supported * As with the SSP, a single combined interrupt is generated as an OR function of the individual interrupt requests. This interrupt replaces the SSP interrupt, which is used solely as an input to the I2S converter. * Additional interrupts: - Transmit FIFO underrun - Transmit frame size error - Receive frame size error * A set of Interrupt registers contain all the information in the SSPIMSC, SSPRIS, and SSPMIS registers, plus the transmit underrun error and frame size errors * Additional status bits: - Transmit FIFO Full - Receive FIFO Empty * Passes SSP data unaltered when module is not enabled * Loopback Test Mode support.
* Hash matching of unicast and multicast destination addresses * Supports physical layer management through MDIO interface * Supports serial network interface operation * Support for: - Half duplex flow control by forcing collisions on incoming frames - Full duplex flow control with recognition of incoming pause frames and hardware generation of transmitted pause frames - 802.Q VLAN tagging with recognition of incoming VLAN and priority tagged frames * Multiple buffers per receive and transmit frame * Software configures the MAC address * Jumbo frames of up to 10,240 bytes supported.
I2C Controller
The I2C Controller includes a two-wire I2C serial interface capable of operating in either Master or Slave mode. The block conforms to the I2C 2.1 Bus Specification for data rates up to 400 kbit/s. The two wires are SCL (serial clock) and SDA (serial data). The I2C module provides the following features: * Two-wire synchronous serial interface * Operates in both the standard mode, for data rates up to 100 kbit/s, and the fast mode, with data rates up to 400 kbit/s * Communicates with devices in the fast mode as well as the standard mode if both are attached to the bus.
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Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
ADC and Brownout Detector
The ADC block consists of an 10-channel, 10-bit Analog-to-Digital Converter with integrated Touch Screen Controller (TSC). The complete touch screen interface is achieved by combining the front-end biasing, control circuitry with analog-to-digital conversion, reference generation, and digital control. The ADC has a bias-and-control network that allows correct operation with both 4- and 5-wire touch panels. A 16-entry x 16-bit wide FIFO holds a 10-bit ADC output and a 4-bit tag number. When the screen is touched, it pushes the conductive coating on the coversheet against the coating on the glass, making electrical contact. The voltages produced are the analog representation of the position touched. The voltage level of the coversheet is converted continuously by the ADC and monitored by the system. Other features include: * 10-bit fully differential Successive Approximation Register (SAR) with integrated sample/hold * A 10-channel multiplexer that routes user-selected inputs to the ADC in single-ended and differential modes * A 16-entry x 16-bit wide FIFO that holds the 10-bit ADC output
* Front bias-and-control network for touch screen interface and support functions, which are compatible with industry-standard 4- and 5-wire touch-sensitive panels * Touch-pressure sensing circuits * Pen-down sensing circuit and interrupt generator * Independent voltage reference generator * Conversion automation function to minimize interrupt overhead * Brownout Detector * Battery Control Signal.
ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings
PARAMETER DC Core Supply Voltage DC I/O Supply Voltage DC Analog Supply Voltage for ADC Storage Temperature SYMBOL VDDC VDD VDDA0 VDDA1 VDDA2 TSTG RATING -0.3 to 2.4 -0.3 to 4.6 -0.3 to 4.6 -0.3 to 2.4 -0.3 to 2.4 -55 to +125 UNIT V V V V V C
NOTE: These stress ratings are only for transient conditions. Operation at or beyond absolute maximum rating conditions may affect reliability and cause permanent damage to the device.
Recommended Operating Conditions
PARAMETER DC Core Supply Voltage (VDDC) DC I/O Supply Voltage (VDD) DC Analog Supply Voltage (VDDA0) DC Analog Supply Voltage (VDDA1) DC Analog Supply Voltage (VDDA2) Clock Frequency Crystal Frequency Operating Temperature (Industrial) MINIMUM 1.7 V 3.0 V 3.0 V 1.7 V 1.7 V 3.27 MHz 10.0 MHz -40C 11.2896 MHz 25C TYPICAL 1.8 V 3.3 V 3.3 V 1.8 V 1.8 V MAXIMUM 1.9 V 3.6 V 3.6 V 1.9 V 1.9 V 76.205 MHz 20.0 MHz +85C 2 3 NOTES 1, 4 4
NOTES: 1. Linear Regulator disabled. 2. With PLL enabled. Without PLL, minimum frequency is 0 MHz. Some peripherals may not operate at minimum frequency. 3. Choose 11.2896 MHz to ensure proper operation of the I2S, USB, and UART peripherals. 4. Core Voltage should never exceed I/O Voltage after initial power up. See "Power Supply Sequencing" on page 28.
Preliminary data sheet
Rev. 01 -- 16 July 2007
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LH79524/LH79525
NXP Semiconductors
System-on-Chip
Power Supply Sequencing
When the linear regulator is not enabled, NXP recommends that the 1.8 V power supply be energized before the 3.3 V supply. If this is not possible, the 1.8 V supply may not lag the 3.3 V supply by more than 100 s. If longer delay time is needed, it is recommended that the voltage difference between the two power supplies be within 1.5 V during power supply ramp up. To avoid a potential latchup condition, voltage should be applied to input pins only after the device is poweredon as described above.
DC/AC Specifications
Unless noted, all data provided are based on: * -40C to +85C (Industrial temperature range) * VDDC = 1.7 V to 1.9 V * VDD = 3.0 V to 3.6 V, VDDA = 1.7 V to 1.9 V.
DC SPECIFICATIONS
SYMBOL VIH VIL VIT+ VITVHYST PARAMETER CMOS input HIGH voltage CMOS input LOW voltage Positive Input threshold voltage (Schmitt pins) Negative Input threshold voltage (Schmitt pins) Schmitt trigger hysteresis Output drive (2 mA type) Output drive (4 mA type) Output drive (8 mA type) Output drive (12 mA type) Output drive (2 mA type) Output drive (4 mA type) Output drive (8 mA type) Output drive (12 mA type) Input leakage pull-up/pull-down resistors Active current Standby current Sleep current Stop1 current Stop2 current Stop2 current Stop2 current Stop2 current MIN. 2.0 2.0 0.8 0.35 2.6 2.6 2.6 2.6 0.4 0.4 0.4 2.6 40 85 50 3.8 420 115 95 45 25 TYP. MAX. UNIT 5.5 0.8 V V V V V V V V V V V V V k mA mA mA A A A A A CONDITIONS CEN = 1 CEN = 1 CSEN = 1 CSEN = 1 CSEN = 1 IOH = -2 mA IOH = -4 mA IOH = -8 mA IOH = -12 mA IOL = 2 mA IOL = 4 mA IOL = 7 mA IOH = 12 mA VIN = VDD or GND (Calculate input leakage current at desired VDD) Note 2 Notes 2, 3
VOH1
VOL1
RIN IACTIVE ISTANDBY ISLEEP ISTOP1 ISTOP2 ISTOP2 ISTOP2 ISTOP2
RTC ON, Linear Regulator ON RTC OFF, Linear Regulator ON RTC ON, Linear Regulator OFF RTC OFF, Linear Regulator OFF
NOTES: 1. Table 2 details each pin's buffer type. 2. Running Typical Application over operating range. 3. Current measured with CPU stopped and all peripherals enabled
Linear Regulator DC Characteristics.
SYMBOL ISLEEPLR IOLR VOLR PARAMETER Current with Linear Regulator disabled Output Current Range Output Voltage, Linear Regulator 0.0 1.84 MIN. TYP. MAX. UNIT 75 8 200 A A mA V IQUIESCENT Quiescent Current
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System-on-Chip
NXP Semiconductors
LH79524/LH79525
AC Test Conditions
PARAMETER Supply Voltage (VDD) Core Voltage (VDDC) Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Levels RATING 3.0 to 3.6 1.7 to 1.9 VSS to VDD 2 VDD/2 UNIT V V V ns V
AC Specifications
All signals described in Table 14 relate to transitions after a reference clock signal. The illustration in Figure 9 represents all cases of these sets of measurement parameters; except for the Asynchronous Memory Interface -- which are referenced to Address Valid. The reference clock signals in this design are: * HCLK, the System Bus clock * PCLK, the Peripheral Bus clock (locked to HCLK in the LH79524/LH79525) * SSPCLK, the Synchronous Serial Interface clock * UARTCLK, the UART Interface clock * LCDDCLK, the LCD Data clock from the LCD Controller * and SDCLK, the SDRAM clock. All signal transitions are measured from the 50% point of the clock to the 50% point of the signal. See Figure 9. For outputs from the LH79524/LH79525, tOVXXX (e.g. tOVA) represents the amount of time for the output to become valid from the rising edge of the reference clock signal. Maximum requirements for tOVXXX are shown in Table 14. The signal tOHXXX (e.g. tOHA) represents the amount of time the output will be held valid from the rising edge of the reference clock signal. Minimum requirements for tOHXXX are listed in Table 14. For Inputs, tISXXX (e.g. tISD) represents the amount of time the input signal must be valid before the rising edge of the clock signal. Minimum requirements for tISXXX are shown in Table 14. The signal tIHXXX (e.g. tIHD) represents the amount of time the output must be held valid from the rising edge of the reference clock signal. Minimum requirements are shown in Table 14.
Power Consumption By Peripheral Device
Table 13 shows the typical power consumption by individual peripheral device. Table 13. Peripheral Current Consumption PERIPHERAL ADC/TSC Counter/Timers DMA Ethernet Controller I2S LCD Controller RTC SSP UARTs USB Device (+PLL) TYPICAL 590 203 4.2 670 200 2.2 5.1 508 203 5.6 (+3.3) UNITS A A mA A A mA A A A mA
REFERENCE CLOCK
tOVXXX tOHXXX
OUTPUT SIGNAL (O)
tISXXX tIHXXX
INPUT SIGNAL (I)
LH79525-28
Figure 9. LH79524/LH79525 Signal Timing
Preliminary data sheet
Rev. 01 -- 16 July 2007
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LH79524/LH79525
NXP Semiconductors
System-on-Chip
Table 14. AC Signal Characteristics
SIGNAL TYPE LOAD SYMBOL MIN. MAX. DESCRIPTION
ASYNCHRONOUS MEMORY INTERFACE SIGNALS A[27:0] Output 50 pF Input tWC tRC tDHWE tDWE tDSCS D[31:0] Output 50 pF tDSOE tDSB tDHCS tDHOE tAV tAHCS tAHOE nCS[3:0] Output 50 pF tASCS tCW tCB tCS tBV tAHB tDB tDHBR nBLE Output 50 pF tDHBW tBR tAB tASB tBLE tBP tASWE nWE Output 50 pF tAW tWR tWP nOE Output 50 pF tOE tOEV tOVA tOVD tOHD tISD tIHD tOVCA tOHCA tOVRA tOHRA tSDCLK/2 - 4.0 ns tSDCLK/2 - 4.0 ns tSDCLK/2 + 4.5 ns tSDCLK/2 - 4.0 ns 5.0 ns 1.5 ns tSDCLK/2 + 4.0 ns tHCLK - 3.0 ns tHCLK - 1 ns tHCLK - 1 ns - 0.5 ns tSDCLK/2 + 4.5 ns tSDCLK/2 + 7.0 ns tHCLK - 4.5 ns tHCLK - 4.5 ns tHCLK + 1.5 ns 2 x tHCLK + 0.5 ns tHCLK - 2.0 ns tHCLK - 6.0 ns 0.0 ns tHCLK + 9 ns -2.0 ns 2 x tHCLK ns 1.0 ns tHCLK - 3.5 ns 1.5 ns tHCLK - 3.0 ns tHCLK - 1.0 ns 2.5 ns 2 x tHCLK + 3.0 ns 2 x tHCLK 3 x tHCLK - 5.0 ns 2 x tHCLK - 5.0 ns tHCLK - 5.5 ns tHCLK - 4.5 ns 14.0 ns 12.5 ns 12.0 ns 0.0 ns 0.0 ns 2.5 ns Write Cycle time Read Cycle time Data out hold to nWE release Data out valid to nWE release Data valid to nCSx release Data valid to nOE release Data valid to nBLEx release nCSx release to data invalid nOE release to data invalid nCSx valid to Address valid Address hold after nCSx release Address hold after nOE release Address valid to nCSx valid nCSx valid to nWE release nCSx valid to nBLE release nCSx width nCSx valid to nBLE valid Address hold after nBLE release Data out valid to nBLE release Data in hold to nBLE release Data out hold to nBLE release Address hold to nBLE release Address valid to nBLE release Address valid to nBLE valid nBLE width (read) nBLE width (write) Address valid to nWE valid Address valid to nWE release Address Hold to nWE release Write Enable width Ouput Enable width nOE valid after nCSx valid Address Valid Output Data Valid Output Data Hold Input Data Setup Input Data Hold CAS Valid CAS Hold RAS Valid RAS Hold
SYNCHRONOUS MEMORY INTERFACE SIGNALS A[23:0] Ouput 50 pF Output 50 pF D[31:0] Input nCAS Output 50 pF
nRAS
Output 50 pF
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System-on-Chip
NXP Semiconductors
LH79524/LH79525
Table 14. AC Signal Characteristics (Cont'd)
SIGNAL nWE SDCKE DQM[3:0] nSDCS[1:0] SDCLK TYPE LOAD Output 30 pF Output 30 pF Output 30 pF Output 30 pF Output 30 pF SYMBOL tOVSDW tOHSDW tOVC0 tOHC0 tOVDQ tOHDQ tOVSC tOHSC tSDCLK tSDCLK/2 - 4.0 ns 19.37 ns tSDCLK/2 - 4.0 ns tSDCLK/2 + 4.5 ns tSDCLK/2 - 4.0 ns tSDCLK/2 + 5.0 ns tSDCLK/2 - 4.0 ns tSDCLK/2 + 4.5 ns MIN. MAX. tSDCLK/2 + 4.5 ns DESCRIPTION SDWE Write Enable Valid SDWE Write Enable Hold SDCKE Clock Enable Valid SDCKE Clock Enable Hold DQM Data Mask Valid DQM Data Mask Hold SDCS Data Mask Valid SDCS Data Mask Hold SDRAM Clock Period tOVSSPFRM Output Valid, Referenced to SSPCLK SSP Transmit Valid SSP Receive Setup Transmit Data Valid after ETHERTXCLK Transmit Data Hold after ETHERTXCLK 25 ns ETHERTXCLK/2 + 2.0 ns 25 ns ETHERTXCLK/2 + 2.0 ns 10 ns 10 ns 10 ns 10 ns Transmit Data Valid after ETHERTXCLK Transmit Data Hold after ETHERTXCLK Transmit Data Valid after ETHERTXCLK Transmit Data Hold after ETHERTXCLK Receive Data Setup prior to ETHERRXCLK Receive Data Hold prior to ETHERRXCLK Receive Data Setup prior to ETHERRXCLK Receive Data Hold prior to ETHERRXCLK
SYNCHRONOUS SERIAL PORT (SSP) SSPFRM SSPTX SSPRX Output 50 pF tOVSSPFRM Output 50 pF Input tOVSSPTX tISSPRX 20 ns 14 ns 14 ns
ETHERNET MAC CONTROLLER (EMC) tOVTXER ETHERTXER Output 50 pF tOHTXER tOVTXD ETHERTX[3:0] Output 50 pF tOHTXD tOVTXEN ETHERTXEN Output 50 pF tOHTXEN tISRXDV ETHERRXDV Input tIHRXDV tISRXD ETHERRX[3:0] Input tIHRXD ETHERTXCLK/2 + 2.0 ns 25 ns
Preliminary data sheet
Rev. 01 -- 16 July 2007
31
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Analog-To-Digital Converter Electrical Characteristics
Table 15 shows the ADC electrical characteristics. See Figure 10 for the ADC transfer characteristics. Table 15. ADC Electrical Characteristics
PARAMETER A/D Resolution Throughput Conversion Acquisition Time Data Format CLK Frequency Differential Non-Linearity Integral Non-Linearity Offset Error Gain Error Reference Voltage Output VREFVREF+ Crosstalk between channels Analog Input Voltage Range Analog Input Current Reference Input Current Analog input capacitance Operating Supply Voltage Operating Current, VDDA0 Powerdown Current, VDDA0 Standby Current Brown Out Trip Point (falling point) Brown Out Hysterisis Operating Temperature -40 2.36 3.0 590 1 180 2.63 120 85 0 500 -0.99 -3.0 -10 -2.0 1.85 VSSA (VREF-) +1.0 V 2.0 VSSA VREF -60 VDDA 5 5 15 3.6 1000 10 300 2.9 MIN. 10 17 3 binary 5,000 3.0 +3.0 +10 +2.0 2.15 (VREF+) -1.0 V VDDA ns LSB LSB mV LSB V V V dB V A A pF V A A A V mV C 4 3 2 2 TYP. MAX. 10 UNITS Bits CLK Cycles CLK Cycles 1 NOTES
NOTES: 1. The analog section of the ADC takes 16 x A2DCLK cycles per conversion plus 1 x A2DCLK cycles to be made available in the PCLK domain. An additional 3 x PCLK cycles are required before being available on the APB. 2. The internal voltage reference is driven to nominal value VREF = 2.0 V. Using the Reference Multiplexer, alternative low impedance (RS < 500) voltages can be selected as reference voltages. The range of voltages allowed are specified above. However, the on-chip reference cannot drive the ADC unless the reference buffer is switched on. 3. The analog input pins can be driven anywhere between the power supply rails. If the voltage at the input to the ADC exceeds VREF+ or is below VREF-, the A/D result will saturate appropriately at positive or negative full scale. Trying to pull the analog input pins above or below the power supply rails will cause protection diodes to be forward-biased, resulting in large current source/sink and possible damage to the ADC. 4. Bandgap and other low-bandwidth circuitry operating. All other ADC blocks shut down.
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Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
OFFSET GAIN ERROR ERROR
1024 1023 1022 1021 1020 1019 1018 IDEAL TRANSFER CURVE
9 8 7 6 5 4 3 2 1 1 2 3 4 5 CENTER OF STEP CENTER OF A STEP OF THE ACTUAL TRANSFER CURVE
ACTUAL TRANSFER CURVE
INTEGRAL NON-LINEARITY
6
7
8
9
1,015 1,016 1,017 1,018 1,019 1,020 1,021 1,022 1,023 1,024
OFFSET ERROR
LSB DNL
LH79525-2
Figure 10. ADC Transfer Characteristics
Preliminary data sheet
Rev. 01 -- 16 July 2007
33
LH79524/LH79525
NXP Semiconductors
System-on-Chip
External Memory Controller Waveforms
The External Memory Controller (EMC) handles transactions with both static and dynamic memory. STATIC MEMORY WAVEFORMS This section illustrates static memory transaction waveforms. Each wait state is one HCLK period. nWAIT Input The EMC's Static Memory Controller supports an nWAIT input that can be used by an external device to extend the wait time during a memory access. The SMC samples nWAIT at the beginning of at the beginning of each system clock cycle. The system clock cycle in which the nCSx signal is asserted counts as the first wait state. See Figure 11 through Figure 20. Read and Write Waveforms Figure 17 shows the Read cycle with zero wait states. As shown in the figure, SWAITOENx and SWAITRDx are programmed to 0 for minimum Read cycle time. The zero programmed into the SWAITRDx indicates that the read occurs with zero wait states, on the first rising edge following Address Valid. After a small propagation delay, nOE is deasserted (as is nCSx), latching the data into the SoC. The address line is held valid one more HCLK period (`C' in the figure). Thus, the minimum Read cycle is two HCLK periods. Figure 18 shows the minimum write cycle time with both SWAITWRx and SWAITWENx programmed to zero. The write access time is determined by the number of wait states programmed in the SWAITWRx register.
In Figure 18, nCSx is asserted coincident (following a small propagation delay) with Valid Address. Data becomes valid another small propagation delay later. Unlike Read transactions, nWE (or nBLEx) assertion is always delayed one HCLK cycle. The nBLEx signal has the same timing as nWE for write to 8-bit devices that use the byte lane enables instead of the write enables. The nWE (or nBLEx) signal remains asserted for one HCLK cycle when the nWE (or nBLEx) signal is deasserted and the data is latched into the external memory device. Valid address is held for one additional cycle before deassertion (`C' in the figure), as is the Chip Select. The minimum Write cycle is three HCLK periods. Read wait state programming uses the SWAITRDx register. Figure 19 shows the results of programming SWAITRDx to 0x3, setting the EMC for three wait states. The deassertion of nOE is delayed from the first rising HCLK edge following Valid Address, as in Figure 17, to the fourth rising edge, a delay of 3 HCLK periods. Figure 20 shows the results of programming the SWAITWRx and SWAITWENx registers for two Write wait states: register SWAITWENx = 0x0, and SWAITWRx = 0x2. Assertion of nCSx precedes nWE (nBLEx) by one HCLK period. Then, instead of the nWE (nBLEx) signal deasserting one HCLK period after assertion, it is delayed two wait states and the signal deasserts on the rising edge following two wait states. Chapter 7 of the User's Guide has detailed register descriptions and additional programming examples.
34
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
tDD_nWAIT_nCS(x) tDA_nCS(x)_nWAIT tDD_nWAIT_nOE
nCS(x)
nOE tA_nWAIT
nWAIT
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction Sequence
WST-3 DELAY
WST-2 DELAY
WST-1 DELAY
SQ-4 nWAIT DELAY
SQ-3 nWAIT DELAY
SQ-2 nWAIT DELAY
SQ-1 nWAIT DELAY
SQ-0 nWAIT DELAY
WST-0 DELAY
NOTES: SQ: nWAIT Sampled and Queued SI: nWAIT Sampled and Ignored
LH79525-133
Figure 11. nWAIT Read Sequence (SWAITRDx = 3) Table 16. nWAIT Read Sequence Parameter Definitions
PARAMETER tDA_nCS(x)_nWAIT tDD_nWAIT_nCS(x) tDD_nWAIT_nOE tA_nWAIT DESCRIPTION Delay from nCS(x) assertion to nWAIT assertion Delay from nWAIT deassertion to nCS(x) deassertion Delay from nWAIT deassertion to nOE deassertion Assertion time of nWAIT 2 MIN. 0 MAX. 16,365 4 4 UNIT 1 HCLK periods HCLK periods HCLK periods HCLK periods
NOTES: 1. The timing relationship is specified as a cycle-based timing. Variations caused by clock jitter, power rail noise, and I/O conditioning will cause these timings to vary nominally. It is recommended that designers add a small margin to avoid possible corner-case conditions. 2. The Read Wait States register (SWAITRDx) must be set to a minimum value of 3. 3. For each rising clock edge (HCLK) that the assertion of nWAIT lags the assertion of nCSx, another read wait state (SWAITRDx) must be added to the minimum requirement. 4. nWAIT delay cycles are not added for all nWAIT assertions sampled prior to WST-3. These nWAIT assertions are ignored. 5. nWAIT delay cycles are added for all nWAIT assertions sampled from WST-3 until the de-assertion of nWAIT. nWAIT delay cycles are added once the wait state countdown has reached WST-1. 6. Once nWAIT is sampled high, the current memory transaction is queued to complete. 7. Since static and dynamic memory cannot be accessed at the same time, any prolonged access (either due to nWAIT or the Extended Wait Register) that causes an SDRAM refresh failure may cause SDRAM data to be lost. 8. Timing assumes Output Enable Delay register (SWAITOENx) is programmed to 0.
Preliminary data sheet
Rev. 01 -- 16 July 2007
35
LH79524/LH79525
NXP Semiconductors
System-on-Chip
tDD_nWAIT_nCS(x) tDA_nCS(x)_nWAIT tDD_nWAIT_nOE)
nCS(x)
nOE tA_nWAIT
nWAIT
SI
SI
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction Sequence
WST-5 DELAY
WST-4 DELAY
WST-3 DELAY
WST-2 DELAY
WST-1 DELAY
SQ-4 nWAIT DELAY
SQ-3 nWAIT DELAY
SQ-2 nWAIT DELAY
SQ-1 nWAIT DELAY
SQ-0 nWAIT DELAY
WST-0 DELAY
NOTES: SQ: nWAIT Sampled and Queued SI: nWAIT Sampled and Ignored
LH79525-134
Figure 12. nWAIT Read Sequence (SWAITRDx = 5)
tDA_nCS(x)_nWAIT
nCS(x)
nOE tA_nWAIT
nWAIT
SI
SI
HCLK
Transaction Sequence NOTES: SQ: nWAIT Sampled and Queued SI: nWAIT Sampled and Ignored
WST-5 DELAY
WST-4 DELAY
WST-3 DELAY
WST-2 DELAY
WST-1 DELAY
WST-0 DELAY
LH79525-135
Figure 13. nWAIT Read Sequence (SWAITRDx = 5): nWAIT has no effect on the current transaction
36
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
tDD_nWAIT_nCS(x) tDA_nCS(x)_nWAIT tDD_nWAIT_nWE
nCS(x)
nWE tA_nWAIT
nWAIT
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction Sequence
WST-3 DELAY
WST-2 DELAY
WST-1 DELAY
SQ-4 nWAIT DELAY
SQ-3 nWAIT DELAY
SQ-2 nWAIT DELAY
SQ-1 nWAIT DELAY
SQ-0 nWAIT DELAY
WST-0 DELAY
END END CYCLE CYCLE nWE nCS(x)
NOTES: SQ: nWAIT Sampled and Queued SI: nWAIT Sampled and Ignored
LH79525-136
Figure 14. nWAIT Write Sequence (SWAITWRx = 3) Table 17. nWAIT Write Sequence Parameter Definitions
PARAMETER tIDA_nCS(x)_nWAIT tDD_nWAIT_nCS(x) tDD_nWAIT_nWE tA_nWAIT DESCRIPTION Delay from nCS(x) assertion to nWAIT assertion Delay from nWAIT deassertion to nCS(x) deassertion Delay from nWAIT deassertion to nWE deassertion Assertion time of nWAIT
NOTES: 1. The timing relationship is specified as a cycle-based timing. Variations caused by clock jitter, power rail noise, and I/O conditioning will cause these timings to vary nominally. It is recommended that designers add a small margin to avoid possible corner-case conditions. 2. The Write Wait States register (SWAITWRx) must be set to a minimum value of 3. 3. For each rising clock edge (HCLK) that the assertion of nWAIT lags the assertion of nCSx, another write wait state (SWAITRDx) must be added to the minimum requirement. 4. nWAIT delay cycles are not added for all nWAIT assertions sampled prior to WST-3. These nWAIT assertions are ignored. 5. nWAIT delay cycles are added for all nWAIT assertions sampled from WST-3 until the de-assertion of nWAIT. nWAIT delay cycles are added once the wait state countdown has reached WST-1. 6. Once nWAIT is sampled high, the current memory transaction is queued to complete. 7. Since static and dynamic memory cannot be accessed at the same time, any prolonged access (either due to nWAIT or the Extended Wait Register) that causes an SDRAM refresh failure may cause SDRAM data to be lost. 8. Timing assumes Write Enable Delay register (SWAITWENx) is programmed to 0.
MIN. 0
MAX. 16,365 6 5
UNIT1 HCLK periods HCLK periods HCLK periods HCLK periods
2
Preliminary data sheet
Rev. 01 -- 16 July 2007
37
LH79524/LH79525
NXP Semiconductors
System-on-Chip
tDD_nWAIT_nCS(x) tDA_nCS(x)_nWAIT tDD_nWAIT_nWE
nCS(x)
nWE tA_nWAIT
nWAIT
SI
SI
SQ-4
SQ-3
SQ-2
SQ-1
SQ-0
HCLK
Transaction Sequence
WST-5 DELAY
WST-4 DELAY
WST-3 DELAY
WST-2 DELAY
WST-1 DELAY
SQ-4 nWAIT DELAY
SQ-3 nWAIT DELAY
SQ-2 nWAIT DELAY
SQ-1 nWAIT DELAY
SQ-0 nWAIT DELAY
WST-0 DELAY
END CYCLE nWE
END CYCLE nCS(x)
NOTES: SQ: nWAIT Sampled and Queued SI: nWAIT Sampled and Ignored
LH79525-137
Figure 15. nWAIT Write Sequence (SWAITWRx = 5)
tDA_nCS(x)_nWAIT
nCS(x)
nWE tA_nWAIT
nWAIT
SI
SI
HCLK
Transaction Sequence NOTES: SQ: nWAIT Sampled and Queued SI: nWAIT Sampled and Ignored
WST-5 DELAY
WST-4 DELAY
WST-3 DELAY
WST-2 DELAY
WST-1 DELAY
WST-0 DELAY
END CYCLE nWE
END CYCLE nCS(x)
LH79525-138
Figure 16. nWAIT Write Sequence (SWAITWRx = 5): nWAIT has no effect on the current transaction
38
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
tRC tDSB tASCS tDSCS, tDSOE tAHCS, tAHOE tAHB
HCLK
A[23:0]
VALID ADDRESS
D[31:0] tCS
VALID DATA
nCS tOEV tOE tDHCS
nOE tDHBR tBV tDHOE
nBLEx tBLE DATA CAPTURED
LH79525-105
Figure 17. External Static Memory Read, Zero Wait States
Preliminary data sheet
Rev. 01 -- 16 July 2007
39
LH79524/LH79525
NXP Semiconductors
System-on-Chip
tWC
HCLK
A[23: 0] tASCS
VALID ADDRESS tAW, tAB
D[ 31:0 ] tCW tCB
VALID DATA
nCS tDWE tDB tDHWE, tWR
nWE tASB tASWE tWP tBP tBR
nBLEx
LH79525-71
Figure 18. External Static Memory Write, Zero Wait States
HCLK tRC
A[23:0]
VALID ADDRESS
D[31:0]
VALID DATA
nCSx DATA CAPTURED nOE
LH79525-72
Figure 19. External Static Memory Read with Three Wait States
40
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
HCLK tWC
A[23:0]
VALID ADDRESS
D[31:0]
VALID DATA
nCSx
nWE or nBLEx
LH79525-73
Figure 20. External Static Memory Write with Two Wait States
Preliminary data sheet
Rev. 01 -- 16 July 2007
41
LH79524/LH79525
NXP Semiconductors
System-on-Chip
SDRAM MEMORY CONTROLLER WAVEFORMS Figure 21 shows the waveform and timing for an SDRAM Burst Read (page already open). Figure 22 shows the waveform and timing for SDRAM to Activate a Bank and Write.
tSDCLK
SCLK
tOVXXX tOHXXX
SDRAMcmd
READ tOVDQ
NOP
NOP
NOP
READ
NOP
NOP
tOHDQ
DQMx
tOVA
A[14:0]
BANK, COLUMN
D[31:0]
tISD tIHD
CAS LATENCY = 2
NOTES: 1. SDRAMcmd is the combination of nRAS, nCAS, nSDWE, and nSDCS(X). 2. tOVXXX represents tOVRA, tOVCA, tOVSDW, or tOVSC. 3. tOHXXX represents tOHRA, tOHCA, tOHSDW, or tOHSC. 4. SDCKE is HIGH.
DATA n
DATA n + 2 DATA n + 1 DATA n + 3
LH79525-3
Figure 21. SDRAM Burst Read
42
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
Preliminary data sheet
tSDCLK SCLK tOVC0 tOHC0 SDCKE tOVXXX tOHXXX ACTIVE tOVA A[14:0] BANK, ROW BANK, COLUMN DATA WRITE tOVA D[31:0] tOVD tOHD
LH79525-24
NXP Semiconductors
Figure 22. SDRAM Bank Activate and Write
Rev. 01 -- 16 July 2007
SDRAMcmd
LH79524/LH79525
NOTES: 1. SDRAMcmd is the combination of nRAS, nCAS, nSDWE, and nSDCS(X). 2. tOVXXX represents tOVRA, tOVCA, tOVSDW, or tOVSC. Refer to the AC timing table. 3. tOHXXX represents tOHRA, tOHCA, tOHSDW, or tOHSC. 4. nDQM is LOW.
43
LH79524/LH79525
NXP Semiconductors
System-on-Chip
External DMA Handshake Signal Timing
DREQ TIMING Once asserted, DREQ must not transition from LOW to HIGH again until after nDACK has been asserted.
DACK/DEOT TIMING These timing diagrams indicate when nDACK and DEOT occur in relation to an external bus access to/from the external peripheral that requested the DMA transfer. The first diagram shows the timing with relation to a single read or the last word of a burst read from the requesting peripheral. The remaining diagrams show timing for data transfers.
DREQ MUST NOT TRANSITON
DREQ MAY TRANSITON tDREQ0L, tDREQ1L
DREQ0, DREQ1
DACK0
nDACK1
NOTE: tDREQ0L = DREQ0 LOW Pulse Width = 2 HCLK MIN. tDREQ1L = DREQ1 LOW Pulse Width = 2 HCLK MIN.
LH79525-5
Figure 23. DREQ Timing Restrictions
HCLK (See Note) A[23:0] ADDRESS
D[31:0]
DATA
nCSx
nWEN
nBLE[1:0]
nOE DACK0/ DEOT0/DEOT1 nDACK1
NOTE: * HCLK is an internal signal provided for reference only.
LH79525-6
Figure 24. Read, from Peripheral to Memory, Burst Size = 1
44
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
HCLK (See Note) A[23:0] ADDRESS
D[15:0]
DATA
nCSx
nWEN
nBLE[1:0]
nOE DACK0/ DEOT0/DEOT1 nDACK1
NOTE: * HCLK is an internal signal provided for reference only.
LH79525-7
Figure 25. Write, from Memory to Peripheral, Burst Size = 1
HCLK*
A[23:0]
ADDRESS
D[31:0]
DATA #1
DATA #2
DATA #3
DATA #4
nCSx
nWEN
nBLE[1:0]
nOE
DACK0/DEOT0/DEOT1
nDACK1
NOTE: * HCLK is an internal signal, provided for reference only.
LH79525-8
Figure 26. Read, Peripheral to Memory: Peripheral Burst Size = 4
Preliminary data sheet
Rev. 01 -- 16 July 2007
45
LH79524/LH79525
46
ADDRESS ADDRESS + 2 ADDRESS ADDRESS + 2 ADDRESS ADDRESS + 2 ADDRESS ADDRESS + 2 LS DATA #1 MS DATA #1 LS DATA #2 MS DATA #2 LS DATA #3 MS DATA #3 LS DATA #4 MS DATA #4 nOE
LH79525-9
HCLK*
A[23:0]
D[31:0]
nCSx
nWEN
NXP Semiconductors
Figure 27. Write, Memory-to-Peripheral: Burst Size = 4; Destination Width > External Access Width
Rev. 01 -- 16 July 2007
nBLE[1:0]
DACK0/ DEOT0/ DEOT1
nDACK1
System-on-Chip
Preliminary data sheet
NOTE: * HCLK is an internal signal, provided for reference only.
System-on-Chip
Preliminary data sheet
DISPLAY-DEPENDENT TURN-ON DELAY 1 STN FRAME DISPLAY DEPENDENT TURN-OFF DELAY PANEL POSITIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL NEGATIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL LOGIC ACTIVE PANEL DATA CLOCK ACTIVE DATA ENABLE TIMING1: VSW = 1 TIMING1: LPP TIMING1: VFP ALL 'LINES' FOR ONE FRAME FRONT PORCH ENUMERATED IN HORIZONTAL 'LINES' SEE 'STN HORIZONTAL TIMING DIAGRAM'
LH79525-44
VDD
VSS
See Note 2
Color LCD Controller Timing Diagrams
LCDVDDEN (DIGITAL SUPPLY ENABLE FOR HIGH-VOLTAGE SUPPLIES)
LCDDCLK (PANEL CLOCK) TIMING2:PCD TIMING2: BCD TIMING2: IPC TIMING2: CPL
NXP Semiconductors
Figure 28. STN Horizontal Timing
Rev. 01 -- 16 July 2007
LCDEN (DATA ENABLE) TIMING2:ACB TIMING2: IOE
LCDFP (VERTICAL SYNCHRONIZATION PULSE) TIMING1: IVS (See Note 3)
PIXEL DATA AND HORIZONTAL CONTROL SIGNALS FOR ONE FRAME
LH79524/LH79525
NOTES: 1. Signal polarties may vary for some displays. 2. See 'STN horizontal timing' diagram. 3. LCDFP with TIMING1:VSW = 0 is only a single horizontal ine period.
47
LH79524/LH79525
48
DISPLAY-DEPENDENT TURN-ON DELAY 1 STN FRAME DISPLAY DEPENDENT TURN-OFF DELAY PANEL POSITIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL NEGATIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL LOGIC ACTIVE PANEL DATA CLOCK ACTIVE DATA ENABLE TIMING1: VSW = 1 TIMING1: LPP TIMING1: VFP ALL 'LINES' FOR ONE FRAME FRONT PORCH ENUMERATED IN HORIZONTAL 'LINES' SEE 'STN HORIZONTAL TIMING DIAGRAM'
LH79525-44
VDD
VSS
See Note 2
LCDVDDEN (DIGITAL SUPPLY ENABLE FOR HIGH-VOLTAGE SUPPLIES)
LCDDCLK (PANEL CLOCK) TIMING2:PCD TIMING2: BCD TIMING2: IPC TIMING2: CPL
NXP Semiconductors
Figure 29. STN Vertical Timing
Rev. 01 -- 16 July 2007
LCDEN (DATA ENABLE) TIMING2:ACB TIMING2: IOE
LCDFP (VERTICAL SYNCHRONIZATION PULSE) TIMING1: IVS (See Note 3)
PIXEL DATA AND HORIZONTAL CONTROL SIGNALS FOR ONE FRAME
System-on-Chip
Preliminary data sheet
NOTES: 1. Signal polarties may vary for some displays. 2. See 'STN horizontal timing' diagram. 3. LCDFP with TIMING1:VSW = 0 is only a single horizontal ine period.
System-on-Chip
Preliminary data sheet
DISPLAY-DEPENDENT TURN-ON DELAY 1 TFT FRAME DISPLAY DEPENDENT TURN-OFF DELAY PANEL POSITIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL NEGATIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL LOGIC ACTIVE PANEL DATA CLOCK ACTIVE DATA ENABLE TIMING1: VSW TIMING1: VBP TIMING1: LPP TIMING1: VFP BACK PORCH ENUMERATED IN HORIZONTAL 'LINES' ALL 'LINES' FOR ONE FRAME FRONT PORCH ENUMERATED IN HORIZONTAL 'LINES' SEE 'TFT HORIZONTAL TIMING DIAGRAM'
LH79525-40
VDD
See Note 2
VSS
LCDVDDEN (DIGITAL SUPPLY ENABLE)
LCDDCLK (PANEL CLOCK) TIMING2:PCD TIMING2: BCD TIMING2: IPC
NXP Semiconductors
Figure 30. TFT Horizontal Timing
Rev. 01 -- 16 July 2007
LCDEN (DATA ENABLE) TIMING2:ACB TIMING2: IOE
LCDFP (VERTICAL SYNCHRONIZATION PULSE) TIMING1: IVS
PIXEL DATA AND HORIZONTAL CONTROL SIGNALS FOR ONE FRAME
LH79524/LH79525
NOTES: 1. Signal polarties may vary for some displays. 2. The use of LCDDSPLEN for high-voltage power control is optional on some TFT panels.
49
LH79524/LH79525
50
DISPLAY-DEPENDENT TURN-ON DELAY 1 TFT FRAME DISPLAY DEPENDENT TURN-OFF DELAY PANEL POSITIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL NEGATIVE HIGH-VOLTAGE SUPPLY ACTIVE PANEL LOGIC ACTIVE PANEL DATA CLOCK ACTIVE DATA ENABLE TIMING1: VSW TIMING1: VBP TIMING1: LPP TIMING1: VFP BACK PORCH ENUMERATED IN HORIZONTAL 'LINES' ALL 'LINES' FOR ONE FRAME FRONT PORCH ENUMERATED IN HORIZONTAL 'LINES' SEE 'TFT HORIZONTAL TIMING DIAGRAM'
LH79525-40
VDD
See Note 2
VSS
LCDVDDEN (DIGITAL SUPPLY ENABLE)
LCDDCLK (PANEL CLOCK) TIMING2:PCD TIMING2: BCD TIMING2: IPC
NXP Semiconductors
Figure 31. TFT Vertical Timing
Rev. 01 -- 16 July 2007
LCDEN (DATA ENABLE) TIMING2:ACB TIMING2: IOE
LCDFP (VERTICAL SYNCHRONIZATION PULSE) TIMING1: IVS
PIXEL DATA AND HORIZONTAL CONTROL SIGNALS FOR ONE FRAME
System-on-Chip
Preliminary data sheet
NOTES: 1. Signal polarties may vary for some displays. 2. The use of LCDDSPLEN for high-voltage power control is optional on some TFT panels.
System-on-Chip
NXP Semiconductors
LH79524/LH79525
1 AD-TFT or HR-TFT HORIZONTAL LINE
*
CLCDCLK (INTERNAL) APBPERIPHCLKCTRL1:LCD CLKPRESCALE:LCDPS (SHOWN FOR REFERENCE) LCDLP (HORIZONTAL SYNCHRONIZATION PULSE) LCDDCLK (PANEL CLOCK) TIMING2:PCD TIMING2:BCD TIMING2:IPC TIMING2:CPL LCDVD[11:0] (LH79525) LCDVD[15:0] (LH79524) 16 x (TIMING0:PPL+1)
AD-TFT and HR-TFT SIGNALS ARE TFT SIGNALS, RE-TIMED TIMING0:HSW
INPUTS TO THE ALI FROM THE CLCDC
001 002 003 004 005 006 007 008 PIXEL DATA TIMING0:HSW + TIMING0: HBP
320
LCDEN (INTERNAL DATA ENABLE) LCDDCLK (DELAYED FOR AD-TFT, HR-TFT) LCDVD[11:0] (LH79525) LCDVD[15:0] (LH79524) (DELAYED FOR AD-TFT, HR-TFT) 1 LCDDCLK ALITIMING2:SPLDEL OUTPUTS FROM THE ALI TO THE PANEL LCDSPL (AD-TFT, HR-TFT START PULSE LEFT) ALITIMING1:LPDEL LCDLP (HORIZONTAL SYNCHRONIZATION PULSE) 001 002 003 004 005 006 317 318 319 320
1 LCDDCLK
ALITIMING1:PSCLS
ALITIMING2:PS2CLS2
LCDCLS
LCDPS
LCDREV
NOTE: * Source is RCPC.
LH79525-42
Figure 32. AD-TFT, HR-TFT Horizontal Timing
TIMING1:VSW LCDSPS (VERTICAL SYNCHRONIZATION) LCDLP (HORIZONTAL SYNCHRONIZATION PULSE) LCDVD[11:0] (LCD VIDEO DATA)
1.5 s - 4 s
NOTE: LCDDCLK can range from 4.5 MHz to 6.8 MHz.
LH79525-43
Figure 33. AD-TFT, HR-TFT Vertical Timing
Preliminary data sheet
Rev. 01 -- 16 July 2007
51
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Synchronous Serial Port
The SSP timing is illustrated in Figure 34.
LH79525-21
tOVSSPFRM
tOVSSPTX
SSPFRM
SSPCLK
SSPTX
tISSPRX
Figure 34. Synchronous Serial Port Waveform
52
Rev. 01 -- 16 July 2007
SSPRX
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
Ethernet MAC Controller Waveforms
The timing for the EMC is presented in the following two illustrations. Figure 35 shows an Ethernet transmit and Figure 36 shows an Ethernet receive.
ETHERTXCLK tOVTXER, tOVTXD, tOVTXEN tOHTXER, tOHTXD, tOHTXEN ETHERTXER, ETHERTX[3:0], ETHERTXEN
LH79525-13
Figure 35. Ethernet Transmit Timing
ETHERRXCLK tISRXDV, tISRXD tIHRXDV, tIHRXD ETHERRXDV, ETHERRX[3:0]
LH79525-14
Figure 36. Ethernet Receive Timing
Preliminary data sheet
Rev. 01 -- 16 July 2007
53
LH79524/LH79525
NXP Semiconductors
System-on-Chip
Reset, Clock, and Power Controller (RCPC) Waveforms
Figure 37 shows the method the LH79524/LH79525 uses when coming out of Reset or Power On.
Figure 38 shows external reset timing, and Table 18 gives the timing parameters.
Table 18. Reset AC Timing
PARAMETER tOSC32 tOSC14 tRSTIH tRSTIW tRSTOV tRSTOH DESCRIPTION Oscillator stabilization time after Power Up (VDDC = VDDCMIN) Oscillator stabilization time after Power Up (VDDC = VDDCMIN) or exiting STOP2 nRESETIN hold time after crystal stabilization nRESETIN Pulse Width (once sampled LOW) nRESETIN LOW to nRESETOUT valid (once nRESETIN sampled LOW) nRESETOUT hold relative to nRESETIN HIGH 200 2 3.5 1 MIN. TYP. MAX. 550 2.5 UNIT ms ms S HCLK HCLK HCLK
VDDCmin
VDDC tOSC32
XTAL32
XTAL14 tOSC14 tRSTIH
nRESETIN tRSTOH
nRESETOUT
LH79525-22
Figure 37. PLL Start-up
tRSTIW
nRESETIN
tRSTOV tRSTOH
nRESETOUT
LH79525-23
Figure 38. External Reset
54
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
UNUSED INPUT SIGNAL CONDITIONING Floating input signals can cause excessive power consumption. Unused inputs which do not include internal pull-up or pull-down resistors should be pulled up or down externally, to tie the signal to its inactive state. Some GPIO signals may default to inputs. If the pins which carry these signals are unused, software can program these signals as outputs, to eliminate the need for pull-ups or pull-downs. Power consumption may be higher than expected until such software executes. Some LH79524/LH79525 inputs have internal pullups or pull-downs. If unused, these inputs do not require external conditioning. OTHER CIRCUIT BOARD LAYOUT PRACTICES All output pins on the LH79524/LH79525 have fast rise and fall times. Printed circuit trace interconnection length must therefore be reduced to minimize overshoot, undershoot and reflections caused by transmission line effects of these fast output switching times. This recommendation particularly applies to the address and data buses. When considering capacitance, calculations must consider all device loads and capacitances due to the circuit board traces. Capacitance due to the traces will
depend upon a number of factors, including the trace width, dielectric material the circuit board is made from and proximity to ground and power planes. Attention to power supply decoupling and printed circuit board layout becomes more critical in systems with higher capacitive loads. As these capacitive loads increase, transient currents in the power supply and ground return paths also increase. Add pull-ups to all unused inputs unless an internal pull-down resistor has been specified; see Table 3. Consider all signals that are Inputs at Reset.
SUGGESTED EXTERNAL COMPONENTS
Figure 39 shows the suggested external components for the 32.768 kHz crystal circuit to be used with the NXP LH79524/LH79525. The NAND gate represents the logic inside the SoC. See the table in Figure 39 for crystal specifics. Figure 40 shows the suggested external components for the 10 - 20 MHz crystal circuit to be used with the NXP LH79524/LH79525. The NAND gate represents the logic inside the SoC. See the chart for crystal specifics.
ENABLE INTERNAL TO THE LH79524/LH79525 EXTERNAL TO THE LH79524/LH79525 XTAL32IN XTAL32OUT
Y1
32.768 kHz R1 10 M C1 15 pF GND NOTES: 1. Y1 is a parallel-resonant type crystal. (See table) 2. The nominal values for C1 and C2 shown are for a crystal specified at 12.5 pF load capacitance (CL). 3. The values for C1 and C2 are dependent upon the cystal's specified load capacitance and PCB stray capacitance. 4. R1 must be in the circuit. 5. Ground connections should be short and return to the ground plane which is connected to the processor's core ground pins. 6. Tolerance for R1, C1, C2 is 5%. C2 18 pF GND
RECOMMENDED CRYSTAL SPECIFICATIONS PARAMETER 32.768 kHz Crystal Tolerance Aging Load Capacitance ESR (MAX.) Drive Level Recommended Part DESCRIPTION Parallel Mode 30 ppm 3 ppm 12.5 pF 50 k 1.0 W (MAX.) MTRON SX1555 or equivalent
LH79525-11
Figure 39. Suggested External Components, 32.768 kHz Oscillator (XTAL32IN and XTAL32OUT)
Preliminary data sheet
Rev. 01 -- 16 July 2007
55
LH79524/LH79525
NXP Semiconductors
System-on-Chip
ENABLE INTERNAL TO THE LH79524/LH79525 EXTERNAL TO THE LH79524/LH79525 XTALIN XTALOUT
Y1
10 - 20 MHz R1 1 M C1 18 pF GND C2 22 pF GND
RECOMMENDED CRYSTAL SPECIFICATIONS NOTES: 1. Y1 is a parallel-resonant type crystal. (See table) 2. The nominal values for C1 and C2 shown are for a crystal specified at 18 pF load capacitance (CL). 3. The values for C1 and C2 are dependent upon the cystal's specified load capacitance and PCB stray capacitance. 4. R1 must be in the circuit. 5. Ground connections should be short and return to the ground plane which is connected to the processor's core ground pins. 6. Tolerance for R1, C1, C2 is 5%. PARAMETER 11.2896 MHz Crystal Tolerance Stability Aging Load Capacitance ESR (MAX.) Drive Level Recommended Part DESCRIPTION (AT-Cut) Parallel Mode 50 ppm 100 ppm 5 ppm 18 pF 40 100 W (MAX.) CITIZEN CM309S - 11.2896 MABJTR or equivalent
LH79525-12
Figure 40. Suggested External Components, 10 MHz to 20 MHz Oscillator
56
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
PACKAGE SPECIFICATIONS
LQFP176: plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm SOT1017-1
c y X
132
89
A ZE
133
88
e E w bp pin 1 index
176 44 45
M
HE
A
A2
A1
(A3) Lp L detail X
1
w e bp D HD
M
v ZD B v
M
A
M
B
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.23 0.13 c 0.20 0.09 D(1) 20.2 19.8 E(1) 20.2 19.8 e 0.4 HD 22.2 21.8 HE 22.2 21.8 L 1 Lp 0.75 0.45 v 0.2 w 0.07 y 0.08 ZD(1) 1.5 1.3 ZE(1) 1.5 1.3
7 0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT1017-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 07-07-07 07-07-07
Figure 41. Package outline SOT1017-1 (LQFP176)
Preliminary data sheet
Rev. 01 -- 16 July 2007
57
LH79524/LH79525
NXP Semiconductors
System-on-Chip
LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls
D B A
SOT1019-1
ball A1 index area
E
A
A2
A1
detail X
e1 e 1/2 e b v w
M M
CAB C
C y1 C y
T R P N M L K J H G F E D C B A
e e2 1/2 e
ball A1 index area
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
X
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max 1.7 A1 0.4 0.3 A2 1.35 1.20
b
D 14.1 13.9
E 14.1 13.9
e 0.8
e1 12
e2 12
v 0.15
w 0.08
y 0.12
y1 0.1
0.5 0.4
OUTLINE VERSION SOT1019-1
REFERENCES IEC JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 07-07-07 07-07-07
Figure 42. Package outline SOT1019-1 (LFBGA208)
58
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
21.25 0.4 1.70 0.25 17.2 NOTE: Dimensions in mm.
176LQFP-FP
Figure 43. LH79525: LQFP176 PCB Footprint
208-BALL CABGA TOP VIEW
A1 BALL PAD CORNER A B C D E F G H J K L M N P R 1.00 0.80 T
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1.00 0.80 0.30 (208 PLACES)
NOTES: 1.00 1. Dimensions in mm. 2. Recommended PCB pad diameter: 0.30 mm.
19.55
22.95
17.2
208CABGA-FP
Figure 44. LH79524: LFBGA208 PCB Footprint
Preliminary data sheet
Rev. 01 -- 16 July 2007
59
LH79524/LH79525
NXP Semiconductors
System-on-Chip
REVISION HISTORY
Table 19. Revision history
Document ID LH79524_525_N_1 Modifications: * First NXP version based on the LH79524/LH79525 data sheet of 20060929 Release date Data sheet status 20070716 Preliminary data sheet Change notice Supersedes 9-29-06 LH79524-525 Data Sheet REV A1
60
Rev. 01 -- 16 July 2007
Preliminary data sheet
System-on-Chip
NXP Semiconductors
LH79524/LH79525
9. Legal information
9.1 Data sheet status
Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
9.3
Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
10. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
(c) NXP B.V. 2007. All rights reserved.
IMPORTANT NOTICE
Dear customer, As from June 1st, 2007 NXP Semiconductors has acquired the LH7xxx ARM Microcontrollers from Sharp Microelectronics. The following changes are applicable to the attached data sheet. In data sheets where the previous Sharp or Sharp Corporation references remain, please use the new links as shown below. For www.sharpsma.com use www.nxp.com/microcontrollers for indicated sales addresses use salesaddresses@nxp.com (email) The copyright notice at the bottom of each page (or elsewhere in the document, depending on the version) - Copyright (c) (year) by SHARP Corporation. is replaced with: - (c) NXP B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or phone (details via salesaddresses@nxp.com). Thank you for your cooperation and understanding, In addition to that the Annex A (attached hereto) is added to the document.
NXP Semiconductors
ANNEX A: Disclaimers (11)
1. t001dis100.fm: General (DS, AN, UM) General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. 2. t001dis101.fm: Right to make changes (DS, AN, UM) Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 3. t001dis102.fm: Suitability for use (DS, AN, UM) Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. 4. t001dis103.fm: Applications (DS, AN, UM) Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 5. t001dis104.fm: Limiting values (DS) Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. 6. t001dis105.fm: Terms and conditions of sale (DS) Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
7. t001dis106.fm: No offer to sell or license (DS) No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 8. t001dis107.fm: Hazardous voltage (DS, AN, UM; if applicable) Hazardous voltage -- Although basic supply voltages of the product may be much lower, circuit voltages up to 60 V may appear when operating this product, depending on settings and application. Customers incorporating or otherwise using these products in applications where such high voltages may appear during operation, assembly, test etc. of such application, do so at their own risk. Customers agree to fully indemnify NXP Semiconductors for any damages resulting from or in connection with such high voltages. Furthermore, customers are drawn to safety standards (IEC 950, EN 60 950, CENELEC, ISO, etc.) and other (legal) requirements applying to such high voltages. 9. t001dis108.2.fm: Bare die (DS; if applicable) Bare die (if applicable) -- Products indicated as Bare Die are subject to separate specifications and are not tested in accordance with standard testing procedures. Product warranties and guarantees as stated in this document are not applicable to Bare Die Products unless such warranties and guarantees are explicitly stated in a valid separate agreement entered into by NXP Semiconductors and customer. 10. t001dis109.fm: AEC unqualified products (DS, AN, UM; if applicable) AEC unqualified products -- This product has not been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and should not be used in automotive critical applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. 11. t001dis110.fm: Suitability for use in automotive applications only (DS, AN, UM; if applicable) Suitability for use in automotive applications only -- This NXP Semiconductors product has been developed for use in automotive applications only. The product is not designed, authorized or warranted to be suitable for any other use, including medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

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